R40230 std ford 3.5748/90.800mm england

R40230 std ford 3.5748/90.800mm england

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Wave Soldering, Reflow Soldering, Reflow Oven | Dektec Automation

| v | s | j | o | k | h | t | g | r | l | y | l | g | x | 选择性波峰焊 . Read More Copyright:Dektec Automation Equipment Co., Ltd)粤ICP备05014378号 v | z | a | u | p | k | z | e | r | c | w | l | c | q | i | x | i | c | q | k | g | d | m | i | l | t | b | m | u | q | e | f | u | v | y | j | k | y | e | i | d | i | w | m | y | k

Dektec Automation Equipment Co., LtdSMT Knowledge-SMT Basic Glossary

. H Halides (halide): containing fluorine, chlorine, bromine, iodine or astatine compounds. Is the flux in the catalyst part, because of its corrosive, must be removed. Hard water (hard water components board design. R Reflow soldering (reflow soldering): through various stages: preheat, stability / drying, reflow peak and cooling, the surface mount components into the solder paste in order to achieve a permanent connection process. Repair (repair

. SEC. X-ray Inspection System and Scanning Electron Microscope

(optional) 4-hole variable aperture (200um, 100um, 50um, 30um) 5-axis manipulator including tilt-axis control X,Y-axis: 40mm / R -axis: 360° T-axis : 0 to 45° Z-axis : 0 to 35mm Dimension : 390mm (W) x 330mm (D) x 560mm ( H ) 390mm (W) x 310mm (D) x 560mm ( H ) / Controller EDX Option Available! EDS (Energy Dispersive Spectroscope

. SEC. X-ray Inspection System and Scanning Electron Microscope

) 4-hole variable aperture (200um, 100um, 50um, 30um) 5-axis manipulator including tilt-axis control X,Y-axis: 100mm / R -axis: 360° T-axis : -20° to 90° Z-axis : 5 to 60mm Max. sample size: 200mm in Diameter, 60mm in Thickness Dimension : Main Unit: 750(W) x 700(D) x 1420 ( H ) mm Table Unit: 1450 (W) x 900 (D) x 750 ( H ) mm Rotary Pump: 430 (W) x 550 (D) x 250 ( H ) mm Links SNE-5000M Technical Data Sheet Contact Us Application Images Share SEC Home | Contact | About us | News / Event

BGA Rework Station — Reflow Oven — SMT Pick and Place Machine — Advanced Techniques US

. Available in benchtop and standalone configurations, these machines are ideal for prototype R &D, NPI, Engineering, Failure Analysis labs as well as OEM / CEM production environments . AT-DB series offers unparalleled performance aimed at applications where precision and consistently high quality results matter. Ranging from R & D, NPI, Engineering, and batch production environments 240 lbs / 110 Kg 280 lbs / 127 Kg Dimensions 36″L x 18″W x 44″ H (915mm x 457mm x 1118mm) 48″L x 18″W x 44″ H (1220mm x 457mm x 1118mm ) 48″L x 28″W x 78″ H (1220mm x 711mm x 1981mm) Warranty Five (5) years parts and labor Five (5) years parts and labor Five (5) years parts and labor

BGA Rework Station — Reflow Oven — SMT Pick and Place Machine — Advanced Techniques US

. Connector filters with fluxed preforms. LED’s in production quantities. Various solder pastes for analysis in an R &D environment. Operation Once the Power-Key switch is turned to the On position, top cover automatically opens while the loading tray slides out : 31″L x 31″W x 50″ H / 787mm x 787mm x 1270mm 31″L x 31″W x 50″ H / 787mm x 787mm x 1270mm Copyright 2009 — 2015. Advanced Techniques US, Inc.

Akrometrix — The Leader in Flatness Measurement and Testing Services

Akrometrix — The Leader in Flatness Measurement and Testing Services Customer Login | Contact Us R E S O U R C E C E N T E R Resource Center White Papers FAQs Industry Standards Magazines . Comparing Techniques for Temperature-Dependent Warpage Measurement Jiahui Pan, Ryan Curry, Neil Hubble, Dirk Zwemer CSP Board Level Reliability — Results H.J. Albrecht, G. Petzold, B. Schwarz, H

Strength and Lifetime Analysis of SMT Solder Joints:

./B o a rd /re flo w p ro c e ss ) X X X X X X d e s tr. M e ta llo g ra p h y X X X X X X d e s tr. R E M (E D X ,W D X ) o n C ro s s S e c tion s X X X X X X n o n d e s t. X — R a y / L a m in o g ra p h y X X X X d e s tr. W ire B o nd p e e l te s t X d e s tr. C o m p o n en t s h e a r te s t X n o n d e s t. In fra re d m ic ro s c o p y X n o n d e s t. U ltra s o n ic m ic ro s c o py X T C T 2 0 T C T -2 0 °C /1 0 0 °C 3 0 ‘1 0 »30 ‘ X X X X X T C T 4 0 S T C T -4 0 °C /1 2 5 °C 1 0 ‘1 0 ‘ @ 8 0 °C X P C T _ rH P C T P v 3 0 ‘3 0 ‘ @ 8 5 °C /8 5 % r.H . X R H R H 8 5 °C /8 5 % r.H . @ 1 V b ia s X M E M e c ha n ic a l s h o c k te s ts (5 0 g -5 0 0 g ) X V I T C T -4 0 °C /1 2 5 °C 2 h 2K /m in 2 h @ V ib ra tio n X In ve s tig a tio ns Strength and Lifetime Analysis of SMT Solder Joints: CSP BOARD LEVEL RELIABILITY — RESULTS H .-J. Albrecht, G. Petzold, B. Schwarz, H . Teichmann Siemens AG Berlin, Germany ABSTRACT The fatigue and damage of solder joints of area array compo- nents as well as the potential for interface failure within chip scale packages ) CSP-f-1 A PI 50 0,8 180 12×12 10,4×10,4 300 Au-WB yes CSP-f-2 A PI 50 0,8 72 8×8 6,24×6,24 300 Au-WB yes CSP- r -1 A C 400 0,8 160 13×13 9,34×9,55 300 Au-WB no CSP- r -2 A C 400 0,8 22 5×3,8 1,55×1,55

TestEquity 1207C Temperature/Humidity Chamber — IBE ID: 160229-003

: Details 208 VAC 28A 1-Phase High: R -404A Low: R -508B Temperature & Humidity Chamber Specifications ( See Details above for installed options ) Temperature -73°C to +175°C Humidity 10% to 95 % RH 7 Cu Ft Workspace, 24 W x 21 H x 24 D (198 liters) Programmable Temperature Controller RS-232/485 Computer Interface High/Low Limit Control and Alarm Non-CFC Cascade Refrigeration Similar Products In Stock

Speedline Electrovert Vectra 450/F Wave — IBE ID : 120201-012

*P R E H E A T M O D U L E Six foot preheat capability Slide-out preheaters Infrared or Vectaheat™ forced convection Patented closed-loop temperature control : VC1104397-01 Vintage : DEC 2000 Details 3 Bottom Convection — 1 Top I/ R Preheaters USI Optiflux Spray Fluxer Right to Left Configuration Rotary Chip Wave, Lambda *C O M P U T E R Windows NT® operating system On-screen context sensitive help Multi-tasking Animated 3D graphical user interface Quick disconnect capabilities *F L U X E R Slide-out fluxer module Onboard flux tank storage Foam or spray flux applicators AccuSpray or SelectaSpray option available *S O L D E R M O D U L E Roll-out solder pot and retractable jacking stand with AC variable speed motors Interchangeable nozzles Low maintenance solder pumps with AC variable speed motors

LED Mounter M3-ETA LED Pick and place machine-ETA-smt, reflow oven,reflow soldering,smt equipment,st

,LED assembly Details Multi-function LED pick and place machine M3 Description : The 3rd-generation M3 multi-function chip Mounter is developed by joint efforts of all ETA R & D team at home and abroad , drawing on the basis ideas of advanced Direction L→ R L→ R (Option: R →L) L→ R (Option: R →L) Nozzle Change Manual Auto Auto Convey Time 3S 3S 3S Mark Camera 0.18S 0.18S 0.18S Machine safety capacity 98/37/EC CE Machine directive 89/336/EEC CE EMC directive 73/23/EEC CE Low voltage directive SEMI S2 Safety standard SEMI S8 Ergonomics standard SEMI E95 Human Interfaces standard Dimension (L*W* H ) 2000x950x1250mm 1650x1680x1520mm 1650x1680x1520mm Weight

C350 Wave Soldering-Wave Soldering Machine-ETA-smt, reflow oven,reflow soldering,smt equipment,stenc

. Specifications C350(3 Preheating Zone) Dimension:L*W* H (mm) 4200 X 1620 X 1700 Weight(kg) Approx.1900kg Power Supply 3P5W,380/220V 50Hz 63A Startup Power (kw → R ;( R →L)option Conveyor Speed(mm/min) 0-2000 Conveyor Height (mm) 750+/-20 Available Component Height(mm) Top120mm/Bottom15mm Conveyor Speed Control Mode Closed Loop Finger Quick-change Finger(standard

PCB glossary —PCBWay.com

? Feedback Capabilities Sponsorships Contact Us [email protected]

a b c d e f g h i j k l m n o p q r s t u v w x y z A 13 Acceptance Test 70 % 6 Guided Probe Method 70% 3 Gull Wing Lead 70% H 3 H.D.I 70% 3 Halides 70% 3 Halogenated Polyester 70% 3 Haloing Mechanically 70 % 12 PTH 70% 13 Pull Strength 70% 17 PWB 70% Q R 11 Radial Lead 70% 10 Reference Edge 70% 12 Re-flow Soldering 70% 13 Re-flow Spike 70% 10 Re-flowing 70% 9 Register Mark 70% 11 Registration 70

PCB Glossary — Printed circuit board Blog — PCBWay

: A diagram which shows, by means of grap… PCB Glossary 9/10/2015 PCB Glossary starting with R reference designator (abbrv. «ref des»): The name of a component on a printed circuit by convention beginning with one or two letters followed by a numeric value … PCB Glossary 9/10/2015 PCB Glossary starting with H HASL – (Hot Air Solder Leveling): A method of coating exposed copper with solder by inserting a panel into a bath of molten solder then passing the panel rapidly past jets of hot air. HDI (High Densi

PERIPHERALS/ BATH / DIP / FUME | JAPAN UNIX -Joining the future-

. 250°C/482 F 250°C/482 F 250°C/482 F Startup time 45 min. ( ambient to 250°C) 40 min. (ambient to 250°C) 40 min. (ambient to 250°C) Crucible size (mm) 245(W) ×295(D) ×58( H ) 146(W) ×248(D) ×58( H ) 117(W) ×177(D) ×59( H ) Voltage AC200V 50/60Hz AC100V 50/60Hz AC100V 50/60Hz Rated voltage . 400°C / 752F 400°C / 752F Startup time 40 min. (ambient to 250°C) 45 min. (ambient to 250°C) Crucible size (mm) 128(W) ×172(D) ×61( H ) 120(W) ×350(D) ×74( H ) Voltage AC200V 50/60Hz AC200V 50/60Hz Rated voltage °C / 752F Standard temp. 400°C / 752F 400°C / 752F Startup time 20 min. (ambient to 250°C) 30 min. (ambient temp to 250°C) Crucible size (mm) 60(W) ×60(D) ×52( H )mm 100(W) ×100(D) ×62( H )mm Voltage AC100V 50/60Hz AC100V 50/60Hz Rated voltage 550W Peripherals Product list METHODS Soldering methods Iron tip Laser Ultrasonic SCHOOL About School Dates and Venues WHITE PAPER Case study Campaign IPC COMPANY Corporate Overview History Domestic Sites Global Network R & reports Search Change Language JP EN ZH DE ES COMPANY PRIVACY POLICY CONTACT (C)Since 1974. JAPAN UNIX SITE MAP ABOUT COMPANY History Our vision Management philosophy Domestic sites Global network R &D center (soldering lab

製品|はんだ槽 吸煙器: — JAPAN UNIX —

。 USS‐350E USS‐250E USS‐180E ▼カタログダウンロード 仕様 型式 USS‐350E(ET) USS‐250E(ET) USS‐180E(ET) はんだ量 約33kg 約15kg 約9kg 最大設定温度 300℃ 300℃ 300℃ 常用設定温度 250℃ 250℃ 250℃ 立上り時間 45分(室温~250℃) 40分(室温~250℃) 40分(室温~250℃) ルツボ内寸 (mm) 245(W) ×295(D) ×58( H ) 146(W) ×248(D) ×58( H ) 117 (W) ×177(D) ×59( H ) 使用電圧 AC200V 50/60Hz AC100V 50/60Hz AC100V 50/60Hz 定格電力 1.6KW 950W 750W 規格 PSE/RoHS対応 PSE/RoHS対応 PSE/RoHS対応 高温卓上はんだ槽 鉛フリーはんだ対応の強化型ルツボを採用した高温はんだ槽です。 ルツボ部・温度調節部 一体型。作業性に優れた省スペースタイプ。 USS-170HE USS-350HE *Discontinued ▼カタログダウンロード 仕様 型式 USS‐170HE(HET) USS‐350HE(HET)※生産終了 はんだ量 約10kg 約25kg 最大設定温度 ‘450℃» ‘450℃» 常用設定温度 400℃ 400℃ 立上り時間 45分(室温~250℃) 40分(室温~250℃) ルツボ内寸 (mm) 128(W) ×172(D) ×61( H ) 120(W) ×350(D) ×74( H ) 使用電圧 AC200V 50/60Hz AC200V 50/60Hz 定格電力 2.1KW 5KW 規格 PSE/RoHS対応 PSE/RoHS対応 高温小型卓上はんだ槽 USS-60HE USS-100HE2 ▼カタログダウンロード 仕様 型式 USS‐60HE USS‐100HE2 はんだ量 約1.4kg 約4.5kg 最大設定温度 450℃ 450℃ 常用設定温度 450℃ 450℃ 立上り時間 20分(室温

250℃) ルツボ内寸 (mm) 60(W) ×60(D) ×52( H )mm 100(W) ×100(D) ×62( H )mm 使用電圧 AC100V 50/60Hz AC100V 50/60Hz 定格電力 550W 1.4KW 規格 PSE/RoHS対応 PSE/RoHS対応 窒素発生装 活用事例 日本精工(株)様 セレスティカジャパン(株)様 (株)アドバンテスト様 IPCトレーニングと認証資格 IPC会員と特典 会社情報 企業概要 概要 沿革 国内拠点 グローバル ネットワーク R &Dセンター 私たちのビジョン ブランドステートメント 経営理念 お問合せ一覧 お問合せ一覧 製品や会社に関するお問い合わせ はんだ付スクールのお申込・お問合せ 導入事例・技術資料ダウンロード 生産終了製品等の一覧 ロボット・自動機 はんだ付コントローラ はんだ送り装置/ヘッド(こて付) レーザーはんだ付/超音波はんだ付 はんだごて(手はんだ用) ミキサー・吸煙器・はんだ槽 こて先・ヒーター(手はんだ用・自動機用) Search Change Language JP EN ZH DE ES

Flex Circuit, Flexible Circuits, and Flexible Printed Circuits | All Flex Inc.

® Rigid Flex Assembly Termination Methods Design Support Design Guide Coverlay Option Conductor & Filleting GuideLine CAD Info Shielding Quick Turn H igh T emp ™ News .dupont.com/Pyralux/en_US/assets/downloads/pdf/APclad_H-73241.pdf (Pyr. AP Flexible Lam.) www.rogerscorporation.com/cmu/pdf/rf8080_01.pdf www.rogers-corp.com/cmu/pdf/rf1000.pdf ( r /flex 1000 Circ. Materials) www.rogers-corp.com/cmu/pdf/rf2005.pdf ( r /flex 2005 Circ. Materials) www.rogers-corp.com/cmu/pdf/rf2001.pdf ( R /flex 2001 Circ. Material) Material Supplier contact Links ® Rigid Flex Assembly Termination Methods Design Support Design Guide Coverlay Option Conductor & Filleting GuideLine CAD Info Shielding Quick Turn H igh T emp ™ News

Find a Rep or Contact All Flex Flexible Circuits | All Flex Inc.

® Rigid Flex Assembly Termination Methods Design Support Design Guide Coverlay Option Conductor & Filleting GuideLine CAD Info Shielding Quick Turn H igh T emp ™ News \Contact an Enginee r x Ph 877-663-7162 x x Minnesota, Western Wisconsin, North Dakota, South Dakota, Nebraska Quist Electronics\Mike Schlagel x www.quistelectronics.com x Ph 952-448-6645 x x x Montana, Wyoming, Colorado, Idaho, Utah Wescom Marketing ® Rigid Flex Assembly Termination Methods Design Support Design Guide Coverlay Option Conductor & Filleting GuideLine CAD Info Shielding Quick Turn H igh T emp ™ News

application specifi c customer needs. Typical lead times 2 – 3 weeks CUSTOM HEATERS FEATURES/ADDED VALUE ALL FLEX • 1-877-663-7162 • www.allfl exinc.com 8 FLEX IB LE H EATER S FLEX IB LE H EATER S FL EX IB LE H EA TE R S 9 ALL FLEX • 1-877-663-7162 • www.allfl exinc.com FL EX IB LE H EA TE R S Now your single or double sided circuit assembly can have built-in heaters • Reduces overall assembly weight • More robust functionality • Lower over all costs Breath Analyzer FL EX IB LE H EA TE R S ALL FLEX • 1-877-663-7162 • www.allfl exinc.com11 Our Vision. is to be your for ex . FL EX IB LE H EA TE R S HEATER APPLICATIONS & STOCK HEATERS OUTDOOR ELECTRONICS Devices and equipment that are exposed to cold temperatures creates design challenges for manufacturers • More robust functionality • Lower over all costs FLEX IB LE H EATER S 10ALL FLEX • 1-877-663-7162 • www.allfl exinc.com HEATER APPLICATIONS FLEX IB LE H EATER S HEATER APPLICATIONS MEDICAL All Flex heaters provide precise heating and thermal control in applications where thermal management is extremely important

. EXAMPLES OF HEATER PERFORMANCE AT 12, 28, & 40 VOLTS Size Resistance Amps Total Wattage Watt Density Voltage 12V 28V 40V 12V 28V 40V 12V 28V 40V 12V 28V 40V 12V 28V 40V H EA TE R ID EN TI FI ER A1 1×1 1×1 1×1 28 28 28 0.4 1.0 1.4 5.1 28.0 57.1 5.1 28.0* 57.1 . See reverse side for ordering info & heater matrix table POLYIMIDE HEATER DESIGN KIT Call: 877.663.7162 o r Email: customersupp [email protected] Order Your Kit Today .001″ Leads 12″ Minimum Bend Radius .25″ R Bond/Peel Strength (to flat plate using PSA) 6 Lb/in * Etched foil heaters are typically used in applications with watt densities 4 kΩ Note: Measurement ranges determine an impedance range and provides information about the current Test Mode and settings of the device: Hold, Audio and Battery Status. TEST mOdE INdICATOR: The Test Mode Indicator sign is located immediately to the left of the Primary Display. Symbols A, R , L, C, |Z|, ESR and Diode indicate Auto, Resistance, Inductance, Capacitance, Impedance and ESR measurement and Diode Test mode respectively. dISPLAYEd PARAmETERS The measurement mode setting ( R , L+ R , C+ R , C+D, L+Q, |Z|, ESR and AUTO) determines the measurement type and the displayed parameters R mOdE: Resistance is shown on the Primary The resistance displayed is either the equivalent series or parallel resistance of the DUT. Resistance units are mΩ, Ω, kΩ, or MΩ. L+ R mOdE: Inductance is shown on the Primary Display and the series

ZK Electronic Technology Co.,LTD.Trade, repair and maintenance of JUKI-YAMAHA and Panasonic SMT

Input impedance: 10 kΩ or more ( H : +2 to + 5.0V L: 0 to 0.6V) Polarity: + Width: 2 μs to 250ms High-speed scanning R / R mode Binning mode off Input impedance: 10 kΩ or more ( H : +2 to + 5.0V L: 0 to 0.6V) Polarity: + Width: 2 μs to 250ms High-speed scanning R / R mode Binning mode off The minimum illumination reaches 1 lux @ F1.8 Horizontal resolution — 500TV line Small, compact body — 29 (W) x 29 ( H ) x 30 (D) / 50g External trigger function : Up to 240 frames / second R / R mode Binning mode on: Up to 360 frames / second Unbalanced Comprehensive indicators details Size (W x H x D) (29 x 29 x 30 mm) Weight 50 g (2 oz) Power Requirements DC 12 V (+10.5 to 15 V) Power consumption

ZK Electronic Technology Co.,LTD.Trade, repair and maintenance of JUKI-YAMAHA and Panasonic SMT

: 47356403 insert pad Next : 45729302 insert pad Commodity Name: 45729304 insert pad Commodity Number: 45729304 On time: 2018-01-06 Views : 3 immediate inquiry details Specification 45729304 insert pad 46806206 BLADE, SHEAR STD RH 46806303 DRIVERBODY, R CI 46806401 FORMER, OUT R5V12 CBD 46806402 FORMER, OUT RT J/W 46806405 FORMER,STD RIGHT 46806406 FORMER, STD RIGHT 46806903 FORMER, INSIDE R 46806905 FORMER, INSIDE R 46807001 BAR, SHEAR 46807101 RAIL, CAM 46807201 RP/48013101/GUIDE, WIRE 46807302 PLATE 46807401 PLATE,SPACER 46813401 REPLACED &C H /D ANVIL 46827801 KIT, TLNG HOUSING, 1996 5MM 46827901 KIT, 1996 5MM TOOLING 46829302 KEY, .188 SQUARE 46839802 ENCODER ADAPTER CABLE ASSY 46851201 GUIDE, SHUTTLE INPUT 46861601 POWER SUPPLY 46861701 BACKPLANE 10 POS 46861901 DRIVE,CD ROM 46865501 PLATE ASSY 46865901 CYLINDER PIVOT ASSY BLOCK, CLAMP 45811901 SPRING, TORSION, L 45811902 SPRING,L TORSION 45812001 SPRING, TORSION, R 45812002 SPRING, R TORSION 45813902 ARM 45814101 CYLINDER,AIR 45814301 BEARING, FLANGED 45814901 SPRING BY: 46445103 45834501 BATTERY,AISI 3000 SERIES 45729304 insert pad 46806206 BLADE, SHEAR STD RH 46806303 DRIVERBODY, R CI 46806401 FORMER, OUT R5V12 CBD 46806402 FORMER, OUT RT J/W 46806405 FORMER,STD

Alpha 1 Technologies | Parts & Accessories

16758000 Clutch 1 16766000 Driver Body R 1 16767000 Driver Body L 1 16770000 Pin 28 16784000 Link 6 16790002 Safety Label 1 16794001 Safety Label 6 16794002 Label,Safety 2 16796002 Safety Label 4 16796003 Label,Safety 21 16802000 Clamp, Cable 6 16813000 Varistor 17 21062000 Link, Connecting 1 21072000 Gear Belt 2 21100000 Sprocket 1 21142000 Rail, R 1 21143000 L Rail 7 21204000 Ball Bearing 3 21272000 Circuit Breaker 2 21278000 Switch 1 21279000 Push Button Switch 2 21280000 Indicator 6 21304000 Shim 9 Switch 0 26094000 Push Button Switch 2 26095000 Push Button Switch 4 26097000 Push Button Switch 12 26132000 Gasket 1 26133000 Bearing 0 26134000 Pin 2 26186000 Plate 1 26187000 Bracket 1 26190000 Transistor 1 26386000 Rail, R 2 26396000 Bar 2 26397000 Block 1 26404000 Pitch WEheel 2 26405000 Pusher 2 26416000 Block 6 26431000 Spring 3 26432001 Contact, L 3 26433001 Contact, R 2 26437000 Block 6 26438000 Shaft 2 26447000 Plate Washer 0 26462001 Screw, Shoulder 0 26462010 Screw, Shoulder 0 26462017 Screw 54 30576401 Stop 7 30577602 Pin 3 30581301 Valve, Flow Control 31 30587602 Bracket, Locking 19 30590701 Pin,Retaining 1 30592005 R -L Pos-S Cable Asm 1 30603101 Nut, Hex Steel 1 30603301 Label 6 30603401 Arm 1 30603402 Arm 2 30603501 Support 2 30603701

Parts | Used SMT and Through Hole PCB Assembly Equipment

16757001 Bearing,Ball 5 16757002 Bearing,Ball 6 16758000 Clutch 1 16766000 Driver Body R 1 16767000 Driver Body L 1 16770000 Pin 45 16784000 Link 6 16790002 Safety Label 1 16794001 Safety Label 6 16794002 Label,Safety 2 16796002 Safety Label 4 16796003 Label Varistor 0 21062000 Link, Connecting 1 21072000 Gear Belt 0 21100000 Sprocket 1 21142000 Rail, R 1 21143000 L Rail 7 21204000 Ball Bearing 3 21272000 Circuit Breaker 2 21278000 Switch 1 21279000 Push Button Switch 2 21280000 Indicator 0 21304000 Shim 9 Switch 0 26094000 Push Button Switch 2 26095000 Push Button Switch 4 26097000 Push Button Switch 12 26132000 Gasket 0 26133000 Bearing 0 26134000 Pin 2 26186000 Plate 1 26187000 Bracket 0 26190000 Transistor 0 26386000 Rail, R 2 26396000 Bar 0 26397000 Block 1 26404000 Pitch WEheel 0 26405000 Pusher 2 26416000 Block 0 26431000 Spring 0 26432001 Contact, L 0 26433001 Contact, R 2 26437000 Block 0 26438000 Shaft 0 26447000 Plate Washer 0 26462001 Screw, Shoulder 0 26462010 Screw, Shoulder 0 26462017 Screw 30576401 Stop 7 30577602 Pin 3 30581301 Valve, Flow Control 2 30581406 L Fitting 0 30587602 Bracket, Locking 0 30590701 Pin,Retaining 1 30592005 R -L Pos-S Cable Asm 1 30603101 Nut, Hex Steel 1 30603301 Label 6 30603401 Arm 1 30603402 Arm 2 30603501 Support 2

. • Equipped with top and bottom heaters (side heaters optional) • ±2°C across belt uniformity typical BTU Technology P R O C E S S C H A M B E R C R O S S — S E C T I O N belt heatersL E F T C E N T E R R I G H T L E F T C E N T E R R I G H T insulation product • Gas safety system monitors ignitors to ensure spent process gas is combusted prior to entering the atmosphere (Hydrogen) or (Reducing Atmosphere) HEAT / GA S BARR I E R belt N2 N2 Applications Support/Process Development BTu International has advanced process applications labs in both the uSA and China

systems. The top three cost drivers account for over 90% of the total cost of ownership in both analyses. For this reason, we will focus our attention on those areas as we examine the cost sensitivities to input parameters t h a t d r i v e m a t e r i a l a signif icant impact on CO O. The sensitivity analysis depicted in Fig. 7 does not, however, include any increased m ate r i a l co n su m p t i o n th at m i g h t be needed to achieve the increased throughput (e.g., longer furnace tube with more wafers Group, NREL and others will go a long way to ensuring that the industry as a whole stays ahead of its cost projections. references [1] SE MI St and ard E35: “Gu ide to C a l c u l a t e C o s t o f O w n e r s h i p (COO) Metrics for Semiconductor : The Supplier’s View”, Solid State Technology , p. 33-37. [4] O E E s o u rce i n fo r m at i o n b a s e d on information provided by V.A. Ames, Equipment Manager, SV TC Technologies, Austin, TX. [5] D h u d s h i a , V. 2 0 0 8 , H i -Te c h Equipment Reliability . It has now been discovered that l o w p r i ce d o e s n o t a l w ay s m e a n the lowest total cost or satisfactory performance. COO is a tool that allows a company to determine the most cost- effective product or service

Microsoft Word — FPX Datasheet_KOREAN v4.docx

… ( s o m e f e a t u r e s l i s t e d a b o v e r e q u i r e p u r c h a s e ) CHAOS SIMPLIFIED! PAD SHAPES Rounded Rectangle Oblong Rectangle D-Shape ROTATIONS FOOTPRINT ELEMENTS ENVIRONMENTS IPC, Manufacturer Recommended, User-Defined JEDEC DIMENSIONS 신뢰성 있는 라이브러리에 의한 고품질 설계로 제조 불량에 따른 재설계를 방지하여 시간과 비용 절감 한국총판 : ㈜한국밸런스 www.va lence.co.kr Te l : 02)445 ‐8661 Fax : 02)2226 ‐5319 서울 강남구 수서동 수서타워 1511 호 제품 구입 Si te : 캐드몰 www.cadmal l . co .kr Con ta c t u s f o r FREE demos and t r a i n i ng ! 라이브러리 전문가 단기간에 라이브러리 전문가화 개인의 숙련도에 관계없이 다양하고 오랜 경험의 숙련된 전문가에 의해 만들어진 듯한 고품질 라이브러리 제작 가능 미시적 /거시적 관점 부서를 초월한 특별한 라이브러리 파라미터 구축 부서별 부품 관리 규정에 관계없이 모든 사람이 마치 한 사람의 전문가에 의해 만들어진 것과 같은 일관된 품질의 라이브러리를 만들 수 있도록 룰의 우선 조건과 제약 사항을

Microsoft Word — LE-Datasheet v36.docx

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5N Plus :: Board of Directors

. She is president of H -Technologies Group, encompassing international business, worldwide manufacturing services and global strategy advisory Vézina Member of the Board Serge Vézina Member of the Board Mr. Vézina is a professional in the field of R &D, innovation and continuous improvement, environmental management and project evaluation for corporations in the private mineral sector with over forty years of broad experience at various levels

& development efforts in which we are increasingly investing. With key deliverables, besides continuous improvement of current operations, being closely associated with our value chain strategy, our R

Journal of SMT Articles

: 1999 — Present Allow time for larger file downloads. YEAR VOL. TITLE AUTHOR DOWNLOAD 2017 30-1 3D Wafer Level Packaging by Using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages L. Hofmann, I. Schubert, D. Wünsch, R . Ecke, K. Vogel, K. Gottfried, D. Reuter, M. Rennau, S.E. Schulz, T. Geßner Purchase And Vibration Environments Pradeep Lall and Geeta Limaye Purchase 26-1 Ag-Au-Ge Alloys for High Temperature Geothermal and Oil Well Electronics Applications P. T. Vianco, R . Grant, J. A. Rejent, T. B. Crenshaw, and A.C. Kilgo Purchase 26-1 Alternatives MOTHERBOARDS TO LEAD-FREE R . Schueller, Ph.D., W. Ables, and J. Fitch, Ph.D. Purchase 22-1 INVESTIGATION OF IMC GROWTH IN TIN SURFACE FINISH AND ITS EFFECT ON SOLDERABILITY IN FC-CSP PACKAGING HyunJung Lee, YeonSeop Yu, HyoJung Kim, Hee-Soo Kim Purchase 22-1 AND SOLDER DIPPING PROCESS G. Subbarayan and R . Kinyanjui, J. Deutsch and M. Purchase 20-3 ULTRASONIC GOLD TO GOLD FLIP CHIP INTERCONNECT PROCESS USING LOW COST SUBSTRATES Philip Couts and M. Kawahara Purchase 20-3 CONSIDERATIONS IN SELECTING FLUXES FOR LEAD Kim, Charles Sharbono, Tom Ritzdorf, and Dan Purchase 19-3 EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, Edwin Lopez, R . Wayne Buttry, Alice K Purchase 19-2 INTEGRATION

Contact Us

. 1996-2000 Greg Evans, Indium Corporation 1994-1996 Bruce Inpyn 1993-1994 Jennie Hwang, Ph.D., H -Technologies Group, Inc : Martin Anselm Chapter Leadership Eileen Hibbler, TEK Products Hutchins Educational Grant R . Wayne Johnson, Ph.D., Tennessee Tech University Board Liaison

Microsoft Word — 593950_OvenSetupWizard_62xx_RevA.docx

; Utilitie digital switch position (on m requiremen rogram unde r and target d name. Oven nce file is re cipe. p. es -> Custom h where unu or off) can b nt al Hygrometer ct only if co ion is not sel ain overview t these as req alog input an re version 6.2. set an Rs232 can be for h llows readin r . ool zone flux lected then c w screen. quired and s nd TPO outpu .0.10 2 com port to heaters or blo ng onitoring da read from S hyper-termin ed on main o setup screen tput. odels. dustries Oct-2014 age 14 of 36 ata from a cu ECS/GEM h nal port overview n. It will urrent host A O P M U C H R C A593950 Oven System Page 4: Movable Rail Units: cm or m enable PV fo ct this option s: select this arning: A mu uld use to he t this option able for SEC r redundant a n on for indi ned in setup w ing screen, a h process ala l board optio for redunda uts can be us ific customer ption is used (MotorA, en ups can be fo ot r requiremen d as backup b coder InputA ormed by sel Change mad xcept channe n three option nly one optio put will mov ed, oven doe ndant second uto acknowle e can be play warning sou ing temperat st. er option usi ndant alarm -7 and oven h process ha

593949_Ver6.2.x.x_Heller_oven-software-log.xlsx

: Light Tower Setup window, change Alarm label to Buzzer — Page2: remove unused “Idle mode energy saving feature” checkbox — Page3: for 1914(single HC2) R -L model, heater channel I/O selection labels are updated as Top2, Bottom2, Top1, Bottom1 — Page6 : overview studio operation for R -L oven models with cool zones — Update to data log file creation to add column header when new file is created — Add : Blower speed L-M- H settings were not matching to actual output, mixed up with adjacent channel — Fixed: Channel setup screen flashing issue — Fixed delay for Dansensor comm loss after turning N2 switch on to allow Rapidox to report proper PPM other than -1 6.2.0.10 Aug-22-2014 Rev-B ECN140042- 001 — Fixed: communication issue for 1914(Single HC2) R -L model — Add new ActiveX function GetRailWidthFloat

Smart Serie: Ringlichter

R -60, Smart Series, Infrared 880 nm 1.0 A 704 5884 R -60, Smart Series, Ultraviolet 375 nm 200 mA 58 424 Aperture Diameter: 1.35” (34.4 mm) Weight: 4 oz. (113 g) Dimensions: H 2.40” (61 mm) x W 2.40″ (61 mm) x D 1.00” (25.4 mm 375 nm 230 mA 66 481 Aperture Diameter: 1.71” (43.4 mm) Weight: 5 oz. (136 g) Dimensions: H 2.80” (71.1 mm) x W 2.80″ (71.1 mm) x D 1.00” (25.4 mm) R 100 Description nm/K CURRENT DRAW 24VDC mcd mw 1.1 A 495814 2338577 R -100, Smart Series, Infrared 880 nm 1.3 A 1105 9236 R -100, Smart Series, Ultraviolet 375 nm 390 mA 108 758 Aperture Diameter: 2.74” (69.5 mm) Weight: 8 oz. (227 g) Dimensions: H 4.00” (101.6 mm) x W 4.00″ (101.6 mm) x D 1.00” (25.4 mm) Ring Illuminator : Der Defekt auf der Oberfläche der Plastikflasche ist klar identifiziert. Funktionalität: R 60 Description nm/K CURRENT DRAW 24VDC mcd mw CONT. STROBE CONT . STROBE R -60, Smart Series, Red 623 nm 1.2 A 283759 2958239 R -60, Smart Series, Blue 470 nm 700 mA 124671 536355 R -60, Smart Series, White 6700 K 700 mA 305710 1512455

R -60, Smart Series, Infrared 880 nm 1.0 A 704 5884 R -60, Smart Series, Ultraviolet 375 nm 200 mA 58 424 Aperture Diameter: 1.35” (34.4 mm) Weight: 4 oz. (113 g) Dimensions: H 2.40” (61 mm) x W 2.40″ (61 mm) x D 1.00” (25.4 mm 375 nm 230 mA 66 481 Aperture Diameter: 1.71” (43.4 mm) Weight: 5 oz. (136 g) Dimensions: H 2.80” (71.1 mm) x W 2.80″ (71.1 mm) x D 1.00” (25.4 mm) R 100 Description nm/K CURRENT DRAW 24VDC mcd mw 1.1 A 495814 2338577 R -100, Smart Series, Infrared 880 nm 1.3 A 1105 9236 R -100, Smart Series, Ultraviolet 375 nm 390 mA 108 758 Aperture Diameter: 2.74” (69.5 mm) Weight: 8 oz. (227 g) Dimensions: H 4.00” (101.6 mm) x W 4.00″ (101.6 mm) x D 1.00” (25.4 mm) 所需设备 通模式 经济和广泛使用的通用设计 可选的适配器允许轻松,直接连接到相机镜头 可选的菲涅尔透镜配件允许照明在不同距离聚焦es 照明示例: 塑料瓶:明显识别塑料瓶顶部的缺陷 功能: R 60 Description nm/K CURRENT DRAW 24VDC mcd mw CONT. STROBE CONT . STROBE R -60, Smart Series, Red 623 nm 1.2 A 283759 2958239 R -60, Smart Series, Blue 470 nm 700 mA 124671 536355 R -60, Smart Series, White 6700 K 700 mA 305710 1512455

Koh Young KY-3030 VAL — Solder Paste Inspection system

(on a calibration target) Volume repeatability on average: less than ±3% at 3σ (on a PCB) Height accuracy: 2μm (on a calibration target) GageR & R : much less than 10% at 6σ (± 50% tolerance) (for around 3,600 solder pastes on real PCBs from customer site . Distance between Solders 100μm (3.93 mils) (in case of 150μm solder paste height) Systems Statistical Analysis Histogram, X Bar & R Chart, X Bar & S chart, Cp & Cpk, % Gage R & R Data,SPI Daily / Weekly / Monthly Reports Inspection Position Teaching No Shadow Effect Camera 2M B/W Digital Camera (1600 X 1200) Dimensions ( W X D X H ) / Weight 1000 X 1290 X 1440 mn ( 40 X 51 X 57 in.) / 750 Kg (1,654lbs) Max. PCB Size VAL: 510 X 460mn(20 X 18 in.) TYPICAL INSPECTION SPEED Type of Sample Board

Koh Young KY-3030 VAL — Solder Paste Inspection system

(on a calibration target) Volume repeatability on average: less than ±3% at 3σ (on a PCB) Height accuracy: 2μm (on a calibration target) GageR & R : much less than 10% at 6σ (± 50% tolerance) (for around 3,600 solder pastes on real PCBs from customer site . Distance between Solders 100μm (3.93 mils) (in case of 150μm solder paste height) Systems Statistical Analysis Histogram, X Bar & R Chart, X Bar & S chart, Cp & Cpk, % Gage R & R Data,SPI Daily / Weekly / Monthly Reports Inspection Position Teaching No Shadow Effect Camera 2M B/W Digital Camera (1600 X 1200) Dimensions ( W X D X H ) / Weight 1000 X 1290 X 1440 mn ( 40 X 51 X 57 in.) / 750 Kg (1,654lbs) Max. PCB Size VAL: 510 X 460mn(20 X 18 in.) TYPICAL INSPECTION SPEED Type of Sample Board

Industry Glossary — Kicthermal.com

& Download KIC Software Industry Glossary Applications Licensing & Warranty A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z A top | next Absolute Zero The temperature at which thermal energy is at a minimum . Forced Convection A type of reflow oven in which the principal heat transfer mechanism is convection . H top | prev | next Heat Sink A body which can absorb thermal energy . Profile A graph of time versus temperature. Profile Prediction This is the phrase that KIC uses to describe the ability of using a known profile to simulate oven recipe changes on the computer. R top | prev | next Rankine An absolute scale based upon the Fahrenheit scale with 180° between the icing point and the boiling point of water. 0°F = 459.67° R . See also Celsius , Fahrenheit , Kelvin Recipe

KIC WaveSurfer Data Sheet

KIC WaveSurfer Data Sheet Making Ovens SmarterTM D o u b l e S i d e d T h e r m a l l y C o n d u c t i v e T a p e U s e d f o r Attaching Thermocouples to PCBs s o l d i n 1 i n c h x 1 0 f o o t r o l l s Rev 1603A — Everywhere R i s k F r e e G u a r a n t e e All KIC products are designed to give maximum value and fast payback by streamlining your thermal process

EP700_side-1_master.indd

. Alerts to insuffi cient volume. Safeguards quality SmartCal cost-free instant process calibration Maximum positional accuracy with 1 micron resolution linear encoders on all axes C O M P R E H E N S I V E LY E Q U I P P E D W I T H . Alerts to insuffi cient volume. Safeguards quality SmartCal cost-free instant process calibration Maximum positional accuracy with 1 micron resolution linear encoders on all axes C O M P R E H E N S I V E LY E Q U I P P E D W I T H on the stencil. Alerts to insuffi cient volume. Safeguards quality SmartCal cost-free instant process calibration Maximum positional accuracy with 1 micron resolution linear encoders on all axes C O M P R E H E N S I V E LY E Q U I P P E D W I T H A DVA N C E D F . The ep700 Series is the ideal platform for low and medium volume assembly in any challenging high-mix surface mount environment. A C C U R A CY Exceptional repeatability and print accuracy stem from meticulous alignment . A S S U R A N C E Europlacer printer platforms are refi ned, robust, design-optimised products built to last. Be assured that ep700 Series printers will perform identically in a decade as they do when new

iiNEO_master.indd

E D E R T E C H N O LO GY S M A RT O P T I O N S I N V E S T M E N T P R OT E CT I O N I N T E G R AT E D I N T E L L I G E N C E E X T R E M E C A PA C I T Y E D E R T E C H N O LO GY S M A RT O P T I O N S I N V E S T M E N T P R OT E CT I O N I N T E G R AT E D I N T E L L I G E N C E E X T R E M E C A PA C I T Y feeders for BGAs Flux feeder PoP processing Tray sequencers Component testing Dispensers PROMON software Stock control Fixed camera F E E D E R T E C H N O LO GY S M A RT O P T I O N S I N V E S T M E N T P R OT E CT I O N I N T E G R AT E D I N T E L L I G . SPECIF ICAT IONS C O N F I G U R E D TO P E R F O R M iineo is never having to say no. The platform takes pole position in the Europlacer product line up and is equipped as standard to remove the need to compromise . iineo can reduce changeovers between multiple board types and batches. It lets contract manufacturers confidently quote every job, and OEMs produce anything that R &D comes up

TDK CUTTER COVER — 556-N-2650G — QYSMT

6S41108 610-05-011 570314-6000 563- H -0950 6S41033 610-00-016 563- H -0360 562- R -0240 6H10206B 605-02-000 562-P-8070 562-P-0140 6317035S 604-00-164 562-K-1040 562-K-0130 610-05-031 604-00-111 562-K-0040 562- H -3411 610-05-019 603-04-093 562- H -3400 562- H -3301 610-05-016 603-04-068 562- H -1430 562- H -1030 610-05-015 602-30-003 562-G-2020 562-G-0080 You Might Like These TDK WASHER

YAMAHA YV180XG LED BOARD — KV1-M6474-000 — QYSMT

) 90933-01J001 BEARING 98907-03010 SCREW, B. H . KGJ-M3169-00X DAMPER, R 91317-04008 BOLT HEX. SOCKET HEAD KGJ-M3173-00X BALL SCREW, R 91317-04010 BOLT HEX post, we accept the customer’s shipping request T/T before shipment, after we shipped the goods, we will email you the shipping information INQUIRY NOW Share This Product Others Spare Parts Part Number Description Part Number Description KGJ-M3161-00X BRACKET, MOTOR R KW3-M653A-10X SENSOR, 1-1 ASSY KGJ-M3133-00X COLLAR, DAMPER 90K55-52170R AC SERVO MOTOR KGJ-M3164-00X DOG, R KG2-M7141-00X BEARING (7000ADF) KGJ-M3165-00X STOPPER, R KG2-M9173-00X LOCK NUT KGJ-M3166-00X FLANGE 90185-01J00 NUT U : FU01SS(M12 . SOCKET HEAD KW3-M3174-00X BEARING, R AXIS 91317-04014 BOLT HEX. SOCKET HEAD KW3-M3175-00X GUIDE, R AXIS 91317-04016 BOLT HEX. SOCKET HEAD You Might Like These YAMAHA YV180XG LED BOARD

SCS Spin Coater 6800 Equipment

in 0.1 second increments (programmable model only) Power 110/240 VAC, 50/60Hz, 1Ø Dimensions (W x D x H ) 13.25 x 18 x 10.8 in / 33.7 x 45.7 x 27.4 cm Product Brochure 6800 Spin Coater Series The SCS 6800 Spin Coater Series enables R on. Product Information Overview Features Chucks Specifications Product Brochure Overview The SCS 6800 Spin Coater Series enables R &D and university laboratories around the world to efficiently and accurately develop and refine coating applications . Has cross and scroll design. Type H : O-Ring Vacuum-Holding Used to hold relative heavy substrates, such as glass, quartz, ceramic and metal

Lab Spin Coating Equipment

> PDS 2010 Labcoter 2 SCS Labcoter ® 2 Parylene Deposition System The SCS Labcoter ® gives university and R &D laboratories the best in Parylene coating technology, in a compact, portable system, enabling researchers to develop and design with the polymer Parylene chiller Chamber options Removable lid chamber Reduced capacity chamber Start-up kit Chart recorder Standard fixture Variable speed tumble coat adapter Specifications SCS Labcoter ® 2 Dimensions (W x D x H ) 19.5 x 23.5 x 50.5 in / 49.5 x 59.7 x , 15A Dimer Capacity Up to 0.38 lbs / 125 gm Vacuum Pump 6.9 CFM / 11.72 m 3 / h , rotary vane (Optional remote mount 10 CFM) Controls Semiautomatic, microprocessor temperature and pressure controls, fault alarm monitoring Mechanical Chiller Dimensions (W x D x H ) 10 x 20 x 18.5 in / 25.4 x

PowerPoint-Präsentation

% 70% 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2013 2014 2015 2016 2017* in C H F Dividend Pay-out ratio in % Technology with Passion Agenda 43 FY Results 2017 | March 15, 2018 1 Comet Group at a Glance R . Lenggenhager 2 Review 2017 Group and Business Lenggenhager, CEO Markus Portmann, CFO Zurich, March 15, 2018 Technology with Passion Agenda 2 FY Results 2017 | March 15, 2018 1 Comet Group at a Glance R . Lenggenhager 2 Review 2017 Group and Business Segments R . Lenggenhager 3 Financial Results M. Portmann 4 Outlook for 2018 R . Lenggenhager 5 Questions | March 15, 2018 1 Comet Group at a Glance R . Lenggenhager 2 Review 2017 Group and Business Segments R . Lenggenhager 3 Financial Results M . Portmann 4 Outlook for 2018 R . Lenggenhager 5 Questions & Answers All Technology with Passion Comet Group delivers further strong results Review of FY 2017 — Group and Business Segments 9 FY Results 2017

Technology with Passion Presentation of results for the first half of 2017 Dr. René Lenggenhager, CEO Markus Portmann, CFO Zurich, 16 August 2017 Agenda 1 Comet Group at a Glance R . Lenggenhager 2 Review of H1 2017 Group and Business Segments R . Lenggenhager 3 Financial Results M. Portmann 4 Outlook for 2017 R . Lenggenhager 5 Questions % of Group sales Showing selected customers only Employees >1300 in R &D >200 We foster a strong global presence and distribution network H1 Results 2017 | August 16, 2017 6 COMET Group at a glance 13 Locations worldwide … Sales outside Switzerland 99% Net sales 2016, in CHF million 332.4 Agenda 1 Comet Group at a Glance R . Lenggenhager 2 Review of H1 2017 Group and Business Segments R . Lenggenhager 3 Financial Results M. Portmann 4 Outlook for 2017 R . Lenggenhager 5 Questions

Jetting Pump for Third Party Integration

) G 38.10 mm (1.50”) H 34.93 mm (1.375”) I 12.70 mm (0.500”) J 25.40 mm (1.00”) K 38.10 mm (1.50”) L 50.80 mm (2.00”) M 28.58 mm (1.125”) N 116.21 mm (4.575”) O 101.09 mm (3.98”) P 6.35 mm (0.25”) Q 44.45 mm (1.75”) R 91.44 mm (3.60”) Pump shown with optional Taper-Lock mounting

Continuously Volumetric Dispensing Article

the co are N gate a is that does PD Global, P ecreasing P nsing is one s esses of scree ensive dispen der mask, so od of dispens ge or fluid res alls apart once into play. Th n the syringe ge that then i per, and fluids time. These m ure or force r h . It is very ing rate, and ssociated wit y is an t recharging i ues, and UV chnology wastage tinuously y has allowed process as well with minimal n n e es r on e e k h is l 2 A fluid produ chara in less sulting in incr 611 Tel: www ously Volum n Costs wit By Ch Global Sales in the October, roduction pro d the P&P pro can do the ap r glob top, th ressure which ranslates to so rs of producti ctors are a lev on the side o friction for th nging (970) 245‐040 w.gpd‐global.c metric Dispen th Continu hristian Vega Manager, GPD , 2011 issue of ocess that doe ocess. All too plication wel is can be the h applies a co ome quantity on vel of of the he ty e the per, he to adjust the mon as im h Street, Grand 08 Email: req com nse Technol uously Volu a D Global f U.S. Tech mag esn’t get as m o often it is be l enough. Fo case. The sim ntrolled burs y of fluid. Thi e pressure or t e valves that a hese valves ar he advantage he

LF-602 Motorized Axial Lead Former-Radial and axial lead forming equipment

of it ● Never damage component leads or components body. Specifications LF-602 — Specifications Model LF-602U LF-602F A 6mm — 40mm 4mm — 18mm B 3.6mm — 10mm adjustable C 1.2mm Min 4mm Min D 1.5-8mm 1.5-8mm H 25mm Max W (diam) ¢0.35 — ¢0.8mm ¢0.35 — ¢0.8mm P 2.5-13.5mm R (radius) 1mm Capacity Taped 35,000/hr Power Supply 220V/50HZ , 1PH Power 40W Dimensions 430mm (L) x 250mm (W) x 250mm ( H )(not include bracket) Weight 24kgs Inquiry in LF-602 Motorized Axial Lead Former

4 Axis Conformal Coating Machine SC-800-4 Axis Conformal Coating Machine SC-800-Quality Selective Co

with rotatable R aix , it can deal with complex process, and the it can fit another precision dispensing valve. CCD programming and fiducial mark positoning system Axis number X,Y,Z, R axis Max Work Movement Speed Max 800mm/s Rotation and tilting angle 90 degree rotation with ±30 degree tilt(option) Max PCB Component Height (SY-5400 and SY-5000 can not be installed simultaneously ) Standard glue 10L Power Supply AC220V 50

60Hz Total Power 2.6KW Air Requirement 0.6Mpa Overall Size L*W* H 1055mm*1447mm*1650mm Weight 1000KG Specifications of valve

Glossary of PCB Assembly Terms | DDM Novastar

. A — Acceptance Tests to Axial Leads B — B-Stage Material to BUS C — CAD to Curing D — Daughter Board to Dynamic Ram (DRAM) E — Edge Clearance to ESR F — Fabrication to Functional Test G — Gerber File to Ground Plane H — HDI to Hole Density I — Icicling to ISO J — JEDEC to Junction L — Laminar Flow to LPI M — Magazine to Multilayer PCB N — NC Drill to NPTH O — Organic Solder Preservative (OSP) to Outgassing P — Package to PTH (plated through-hole) Q — Quadpack to Quench R — Read Access Memory (RAM

Glossary of PCB Assembly Terms | DDM Novastar

. A — Acceptance Tests to Axial Leads B — B-Stage Material to BUS C — CAD to Curing D — Daughter Board to Dynamic Ram (DRAM) E — Edge Clearance to ESR F — Fabrication to Functional Test G — Gerber File to Ground Plane H — HDI to Hole Density I — Icicling to ISO J — JEDEC to Junction L — Laminar Flow to LPI M — Magazine to Multilayer PCB N — NC Drill to NPTH O — Organic Solder Preservative (OSP) to Outgassing P — Package to PTH (plated through-hole) Q — Quadpack to Quench R — Read Access Memory (RAM

NIX,INC. -product lines Industrial plastic fasteners RECYCLE FASTENER-

No. Thickness of the board (t) Hole diameterΦ Qty/bag JDW-3S 0.8~2.0 4.8 +0.2 -0 500 [ pagetop ] SIDE PUSH LOCKING WIRE SADDLE SIDE PUSH METHOD LOCKING WIRE SADDLE Can be inserted in and removed from the front side Direction fixed when inserting Nylon 6-6 Natural (White) Specifications Unit : mm Model No. A B C (D) (E) (F) (G) ( H ) (J when inserting Nylon 6-6 Natural (White) MT-30 [ pagetop ] BAND FIXTURE ※Suitable for binding bands, T-18S, R , L, and SKB-85 BAND FIXTURE ※Suitable for binding bands, T-18S, R , L, and SKB-85 Can be inserted in and removed from the plate with one touch Fixture for cable ties Space saving with 1mm protrusion to the other side

*Please refer to page 6 W:320 W:320 C L W H D E P A B Reference position Guide rail dimensions AJ A B H :563 135˚C 165˚C 135˚C 135˚C 165˚C 135˚C 165˚C 135˚C 165˚C 135˚C 165˚C 135˚C 165˚C 135˚C 165˚C 135˚C 135˚C 135˚C 535 535 535 535 535 460 460 460 460 535 535 535 535 535 535 400 400 400 R h t t p : / / w w w . n i x . c o . j p NIX TRADING (THAILAND) LTD. NIX PCB SOLUTION GUIDE NIX is the best partner for improving your factory NIX, INC . NIX’s one-stop solution for customers. R &D center research-and-development Headquarters Nagoya Office Osaka Office Global Production Management HQ NIX OF SHANGHAI LIMITEDNIX OF HONG KONG LIMITED NIX OF ZHONGSHAN MANUFACTURING LIMITED Always Challenging. Always Original. Always Speedy . NAVI is now available for focused expertise in printed board traceability. h t t p : / / w w w . l a b e l n i x . c o m NIX OF AMERICA NIX OF AMERICA 2055, Junction Ave, Suite 230, San Jose, CA 95131 Tel: +1-408-321-8286 Fax Position Guide Rail Dimension Weight (kg) Base Material Number of PCB Capacity Availability in Reverse Stopper Bar (optional) Adjustable WidthL (length) W (width) H (height) Method for Width Adjustment Max Tolerant Temperature for the Cardguide

Auction Details — Abamex

. 6 issues 2000. 6 issues 2001. 3 issues 2002. Barbie. (ref 1210) Details 2005 Three (3) Barbies. Three (3) Barbies. — Im a Toys r us Kid. Rappin Rocking. Talk with me . I’m a Toys R Us Kid Barbie. Toys R Us Collection. Year 97. Prod. Code 18895. NRFB (ref 1073) Rappin Rockin Barbie. Year 91. Prod. Code 3248. NRFB (ref 1112) Talk With Me Barbie ) Pepsi Spirit Barbie. Toys R Us Collection. Year 89. Prod. Code 4869. (ref 1101) Toy Story 2 Tour Guide Barbie. Sp Ed. Year 99. Prod. Code 24015. (ref 1140) Coca-Cola Party Barbie . Details 2042 Full Suit Of Armor. 80in H . qty 1 Details 2043 Carved Wooden 4-Panel Screen. 6ft high. Qty. one Details 2044 Coffee brewer two pot with 4 warmers on top + Coffee brewer Bunn . Set of 3 (sun star moon with star). 14in h . 1.5in w. qty 64 chime sets per case. X$ Details 2084 Five illustrations limited edition. Comic book transformer type image. Each signed and numbered in pencil. 1994. Details 2085 The Silverwolf bulletin

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. Elbow unit 47 in. W x 67 in. H ( qty. 2). Steel arches with easy assembly holes with duct (approx. 25 pcs.). 8 ft. long pieces (qty. 5). 4 ft. long piece (qty. 1). 3 ft. long piece (qty. 1). Small Elbow unit 3.4 ft. x 2.5 ft. (qty. 1). 6.6 ft. x 2.7 ft . Drum blue color 55 Gallon 18 gauge thick. Twin Turbine electrical p vacuum pump. 17 AMPS Volts 120. (Also used for pet grooming). Details 94 Liquid chiller cooling system Liquid chiller cooling system — Cornelius liquid chiller cooling system. Model No.CH2002A 2CS. 230 V. 60HZ. 3PH. 14 AMPS. R 134A Refrigerant . (Photo with motor serial number might not match this unit. It is one of the 3 pumps). More details on attached PDF file.Dutchi3 phase induction motor type DMA-IE290Lx4. 600V 60Hz 2.2Kw 3.5A. 1710 r /min.With hydraulic ram

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/ 114 SMD */ H2=N2; /* 2 U5-14 H ** All 3 Pins SMD */ TERADYNE OUTPUT: INPUTLIST, C:PCB.IPL SH,0,1,16-1999 R ,R1,»RES,P1,150k,5%»,150k,5%,0,0C,C8,»CAP,C8,.1UF,20%»,.1UF,20%,20%,22,0 C,C9,»CAP,C9,47UF,20%»,47UF,20%,20%,22,0 D,CR3,»»,0,173 D,D1,»DIODE «,176,151 IC,U14,»P/N 74HCT74»,74HCT74,95,96,97,98,85,84,83,82,81,92,93,99,100,101,102,103 TAKAYA FLYING PROBE: @M CA9 format (Bottom Side) @CE @ H +421640 -547370 IP2P1 P-Auto P3_3V-P1_8V_ * R N61 N164 @K OP IP2P2 P-Auto P3_3V-P1_6V_ * R N61 N201 @K OP IP2P3 : %CIRCUIT; GND EXT ,N1; VCC EXT ,N35; C1 C 1=N1, 2=N1; C10 C 1=N9, 2=N1; D1 CR A=N163, C=N138;C1 C 1=N1, 2=N1; %VALUE:12345; C1 = .022U, +20%, -20%, MSG=’S13-217 PL#1 ‘; CR3 = 800M, +5%, -5%, MSG=’S13S-45 PL#77 ‘; %ADAPTER:2282:TEMP; H1=N1; /* 1 U2-3 H 84 P-Auto P3_3V-P2_5V * R N61 N87 @K OP IP2P4 P-Auto P3_3V-P5_0V * R N61 N88 @K OP IP2P5 P-Auto P1_8V_-P1_6V_ * R N164 N201 @K OP C50 10UF 391781-01-4 * C N30 N2 @T 20 20 C51 10UF 391781-01-4 * C N1 N2 @T 20 20 CR30 * 385848-05-6 * D N22 N8 @T 7 6 CR20 the first time through!» Jerry H . Surface Tech «Price and performance, there is nothing like UniSOFT … I have reviewed others Test software but they just didn’t match up to the UniSOFT software …» C. Drew Nexus «Just yesterday I installed the Pronto TEST

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*/ H2=N2; /* 2 U5-14 H ** All 3 Pins SMD */ TERADYNE OUTPUT: INPUTLIST, C:PCB.IPL SH,0,1,16-1999 R ,R1,»RES,P1,150k,5%»,150k,5%,0,0C,C8,»CAP,C8,.1UF,20%»,.1UF,20%,20%,22,0 C,C9,»CAP,C9,47UF,20 EXT ,N1; VCC EXT ,N35; C1 C 1=N1, 2=N1; C10 C 1=N9, 2=N1; D1 CR A=N163, C=N138;C1 C 1=N1, 2=N1; %VALUE:12345; C1 = .022U, +20%, -20%, MSG=’S13-217 PL#1 ‘; CR3 = 800M, +5%, -5%, MSG=’S13S-45 PL#77 ‘; %ADAPTER:2282:TEMP; H1=N1; /* 1 U2-3 H 84/ 114 SMD

Teradyne Users Group (TUG) 2018 Hot Topics

Teradyne Users Group (TUG) 2018 Hot Topics HOT TOPICS 2018 TERADYNE USERS GROUP | Hot Topics M AY 8 — 9 , 2 0 1 8 · S H A N G H A I , C H I N A T E R A D Y N E U S E R S G R O U P 20 18 Test System Instrumentation Capability Extension

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IPC Members Only

. This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013. Trends in Advanced Circuit Board Technologies and the Impact on the Chip World Presentation by Dr. H David Everheart of Aperion Global How to Start a Manufacturing Operation in Mexico Eduardo R . Saavedra of The Offshore Group How to Start Your Business in India Gunjan Bagla of Amritt, Inc. These presentations were recorded live in Las Vegas, Nevada during the IPC Midwest Conference and Exhibition, September 20-25, 2008 The R &D Tax Credit A special presentation with IPC and McGuire Sponsel LLC Building a Marketing Strategy Karen Carpenter outlines best practices in marketing. Death of a PCB

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Speedprint Technology — Photo Stencil Equips R&D Lab with Speedprint Stencil Printer

Colorado Springs, CO – October 11, 2012 – Photo Stencil , LLC, a leading full-service provider of hig h -performance stencils and tooling, has added a Speedprint stencil printer to its R Speedprint Technology — Photo Stencil Equips R &D Lab with Speedprint Stencil Printer Search. About us History Blakell group background Certification Products SP210avi SP700avi SP710avi Solutions Laser Tooling 2D & MarketingTools Remote Support Map Login Form User Name Password Remember Me Forgot your password? Forgot your username? See us on Home Press releases Press releases Photo Stencil Equips R &D Lab with Speedprint Stencil Printer Photo Stencil Equips R &D Lab with Speedprint Stencil Printer Will enhance stencil development and optimization of customers’ processes &D lab to further enhance process optimization for its stencil customers. The new SP700avi will be used for R &D to develop next generation stencil technology, to print customer boards, and to develop processes customized precisely for the customer’s application and process

Thermosonic Flip Chip Bonding

µm accuracy High volume manufacturing system FineXT 5205 Automated Flexible Bonding Platform High accuracy R &D and Production FINEPLACER . Products FineXT 6003 Multi-chip, Multi-placement Die Bonder Up to 3 µm accuracy High volume manufacturing system FineXT 5205 Automated Flexible Bonding Platform High accuracy R : Laser Bar Bonding R &D Bonder FINEPLACER ® lambda — R &D Bonder Sub Micron Die Bonder FINEPLACER ® sigma Blog #22 — Is Rework a Commodity to — application video Audio Chip Repair How to — application video Markets Industries Served Medical For medical electronics R &D and manufacturing, the requirements are particularly high for quality, reliability, space and weight. R &D / Universities The common , H . de Vries, “Thermosonic Bonding of High Pin Count Flip-Chips on Flexible Substrates” IMAPS Annual Symposium on Microelectronics, 2005. [4] George Riley, “Stud Bump Flip Chip Assembly of MEMS Motion Sensors,” IMAPS New England Symposium, May 8, 2001

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ECM Sales Inc.

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Microsoft Word — 285_285-25_TDS_a.doc

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KH-7700 | Hirox Digital Microscope System | Seika Machinery, Inc

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PCB Laser Structuring with ProtoLaser R — LPKF Laser & Electronics AG

PCB Laser Structuring with ProtoLaser R — LPKF Laser & Electronics AG International Menu Home Products PCB Prototyping PCB Milling Machines Prototyping Laser Systems Multilayer SMT Assembly Through-hole Plating Board Finish and Coatings True Quick Turn Accessories Support My account Knowledge Center Webinars Papers Videos Blog Blog Contact 1-800-345-LPKF ProtoLaser R Laser Structuring with Ultrafast Laser Source You are here: Products > PCB Prototyping > PCB Milling Machines > ProtoLaser R Description Application Specs Pricing & Info Laser Ablation with Virtually No Heat Input In laser technology, the shorter the pulse, the lower the heat input into the surrounding material . Proven Housing The new ProtoLaser R is packaged in the familiar thirdgeneration ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door . The LPKF ProtoLaser R features a laser source with a laser power of up to 4 W. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control

Entry-Level PCB Plotter ProtoMat E34 / E44 — LPKF Laser & Electronics AG

. A comprehensive parameter library for many commonly used materials supports the users in their own projects. ProtoMat Engineering The LPKF ProtoMat PCB milling systems utilize the highest quality stepper motors, spindle motors and H -shaped guide rails mounted to a durable frame to ensure pristine milling ± 20 µm (± 0.8 mil) ± 20 µm (± 0.8 mil) Resolution camera — 1.3 Mpx Dimensions (W x H x D) 370 x 300 x 450 mm ( 14.6” x 11.8” x 17.7”) 370 x 300 x 450 mm ProtoLaser R ProtoLaser 3D Through-hole plating and multilayer solutions Board Finish & Coatings SMT Assembling Equipment Software Tools

IPC JSTD-001 specification for training and reference | Soldertools.net

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BGA rework stencil for fast BGA placement without high end rework equipment ! soldertools.net

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ISVI Corporation

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ISVI Corp. Releases All-New 12 Megapixel Compact CoaXPress CMOS Camera > News | ISVI Corporation

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Product Videos

. Die aus Spezialstahl angefertigten Rundmesser und die dazu gehörenden Messerfassungen garantieren Ihnen eine lange Lebensdauer. Trennlänge bis zu 300 mm, Größe ( H x B x . Die aus Spezialstahl angefertigten Rollmesser und Linearmesser garantieren Ihnen eine lange Lebensdauer. Größe( H x B x T):431 mm x 685 mm x 304 mm, Gewicht Abständen von Komponenten sind für die Serien K3000 und K4000 spezielle Linearmesser lieferbar. Die aus Spezialstahl angefertigten Rollmesser und Linearmesser garantieren Ihnen eine lange Lebensdauer. Größe( H x B x . R 100 Fraesmachine fuer Nutzentrennen Die R100 trennt umrißgefräßte Nutzenleiterplatten schonend und schnell. Zwei einstellstifte mit fraeswerkzeug in der mitte geben eine gerade oder runde leitpfahd auf dem die

Milprobes for BGA, SMT, Through Hole

Milprobes for BGA, SMT, Through Hole B E A U T E C H , I N C . 9 8 E L M S T . P O R T L A N D , M E 0 4 1 0 1 U S A Please fax the following info to 207-775-7710

The interior view of the Windows NT® powered CAMALOT XyflexPro. The Flexibility You’re Looking For ➤ ➤ M O D U L A R I T Y = F L E X I B I L I T Y 30,000 DPH 50,000 — 60,000 DPH 100,000 — 120,000 DPH L I N E O P T I M I Z A T I O N A N D P R O G R A M M I N G A C H I E V E D T H R O U G H O N E H O S T C O M P U T E R www.speedlinetechnologies.com S X Y F L E X P R O™ S P E C I F I C A T I O N S S M A L L P L A T F O R M L A R G E P L A T F O R M Footprint (W x D x H ) 31″* x 50″ x 55″ (787mm x 1268mm x 1397mm (application dependent) 30,000 dph (application dependent) D I S P E N S I N G R A T E I N C R E A S E S W I T H M U L T I P L E P L A T F O R M L I N K — U P Computer operating system Windows NT® Program storage 6.5 GB Hard Drive; 1.44 MB ., 50/60 Hz, Single Phase, 3 wire grounded Pneumatic requirements 10 SCFM (30m3/min) of clean dry air, 5 micron filtered air at > 80 PSI (5.5 bars) R E C O M M E N D E D M A C H I N E C O N F I G U R A T I O N B Y A P P L I C A T I O N S M T S E M I C O N D U C T O R Material Solder paste, adhesive, conductive adhesive Underfill, encapsulation *Conveyor width 575-38588_XyflexPro.qxd 9/27/00 4:41 PM Page 2 S P E E D L I N E T E C H N O L O G I E S MODULAR DISPENSING SYSTEM ➤ C A M A L O T X Y F L E X P R O

Accuflex_rev14.qxd

:20 PM Page 6 B O A R D H A N D L I N G Maximum Board Size (X x Y) 23″ x 20″ (584mm x 508mm) Minimum Board Size (X x Y) 3″ x 2″ (75mm x 50mm) Board Thickness 0.03″ to 0.20″ including warpage Accuflex_rev14.qxd A C C U F L E X TM C O O K S O N E L E C T R O N I C S E Q U I P M E N T M P M ® Unparalleled printing value, uncompromising production f lexibility. Accuflex_rev14.qxd 5/20/2003 5 . TMMPM AccuFlex Unparalleled printing value, uncompromising production f lexibility. Accuflex_rev14.qxd 5/20/2003 5:17 PM Page 1 C O O K S O N E L E C T R O N I C S E Q U I P M E N T Unparalleled printing value, uncompromising production f lexibility ) Method of Board Hold-Down Positive edge-clamps (front and rear) Method of Board Support Independent, moveable magnetic support pins P R I N T P A R A M E T E R S Maximum Print Area (X x Y) 22″ x 19.6″ (559mm x 498mm) Snap-off Speed 0.008″ — 0.39″/sec (0.2mm — 10mm/sec) Print Speed 0.2″ — 7.87″/sec (5mm — 200mm/sec Standard shape fiducials. See SMEMA standards. Camera System Single roving camera module with dual beam optics P E R F O R M A N C E Vision Alignment Repeatability +/- 0.001” (+/- 0.025mm) at 6 sigma (Cp greater than or equal to 2.0*) verified with glass

of our customers, all products available at STI can be purchased from our E-Store accessible at www.stielectronicsinc.com Phone: 800-858-0604 Fax: 888-650-3006 page 11 www.metcal.com New Metcal HCT2-120 Digital Hot Air Pencil HA ND H EL D CO NV EC TI ON R www.metcal.com New Metcal HCT2-120 Digital Hot Air Pencil HA ND H EL D CO NV EC TI ON R EW OR K HCT2-120 Digital Hot Air Pencil includes: Power system with hand-piece and heater, pack of 6 nozzles, workstand with nozzle plate holder and a nozzle removal pad C s P L C C s 0 2 0 1 s 1 2 1 0 s O t h e r a p p l i c a t i o n s : R e f l o w o f f i n e p i t c h Q F P s , r e m o v a l a n d p l a c e m e n t o f c h i p s T h e h e a t e r c a n e a s i l y b e r e m o v e d a n d r e p l a c e d f r o m Kahnetics Kester Lewis Bins Liberty Packaging Lindstrom Lista Lufkin Luxo Lighting LW Scientific Metcal Micro-Care Nicholson O.C. White Pace Panavise Plato Products Production Basics Puritan QRP R & R Lotion Scienscope Simco Static Tech Steinel Swanstrom Stability 10% of display value Certifications / Markings cNRTLus, CE, RoHS + WEEE Surface Resistivity 105 Ω -109 Ω /sq Power Supply Dimensions w x d x h 10.6 cm (4.2″) x 21.3 cm (8.4″) x 17.0cm (6.7″) 183 cm (72″) SJT Workstand Dimensions w x d x h 7.6 cm

FebNewsletter3

. S O L D E R I N G T E C H . C O M Soldering Technology International, Inc. (STI) STI, under the leadership of my son David E. Raby, has established the most advanced analytical laboratory in the industry . Dan Foster received the Presidents Award and Mel Parrish re- ceived a Distinguished Committee Service Award. Congratulations! Fine Pitch Surface Mount Kit now available CONTAINS SST-UNV-1 PWB 0201- R -TR7 (0201 Resistors) 0402- R -TR7 (0402 Resistors) 1206 — R -TR7 (1206 Resistors) SOLIC18-T2 (SOLIC 18) FPBGA144 (FPBGA144) BGA272 (BGA 272) TBGA352 (TBGA 352) LQFP44-T30 (LQFP44) LQFP168-T12 (LQFP168) TQFP64-T20 (TQFP64) Tape and Reel LQFP’S and TQFP Note . 102 Tribble Drive Madison, AL 35758 Phone: 256-461-9191 Fax: 256-705-5538 S T I I S AL S O A R E S O U R C E F O R T R A I N I NG M AT E R I A L S, E NG I N E E R I N G S E R V I C E S, A N D P R O D U C T D I S T R I B U T I O N V I S I T W W W

0.01-3,0 ccm Further units and consumables under www.martin-smt.de L e ve l S ta tu s M e n ü S ta rt R CD00.0110 Auto Vacuum Di sp en sT ec hn ik R s DK00.0030 DK06.0002 5 ccm Nozzle Heat DK06.0003 10 ccm Nozzle Heat DK06.0004 30 ccm Nozzle Heat DK06.0005 55 ccm Nozzle Heat 5 ccm 10 ccm HT00.8009 0.080.17 0.17 HT00.8004 0.0 HT00.8010 0,2mm VD90.0039 HT00.9009 0.0 mm HT00.9023 1.6 — 2.2 mm HV00.0013 1 2 3 4 M e s s -S c h a b lo n e -3 m m ) K le b s to ff -V o lu m e n -M e s s g e r „ t 3 KVM03 0.01-3.0 qmm

PD80.1012 5 ccm 7 pin PD60.1012 5 ccm 7 pin Heat 3 ccm / 5 ccm PD10.0012 1 2 3 4 M e s s -S c h a b lo n e -3 m m ) K le b st o ff -V o lu m e n -M e ss g e r „ t 3 KVM03 0.01-3.0 qmm

Techspray Catalog

• Safe for Energized Equipment Specifications: Ford Tox #1422434, GM HMA 120993- H , McDonnell-Douglas 558-1672-10S, NSN# 6850-01-406-1356 (1672-10S) 1672-10S 10 oz aerosol 1672-15S 15 oz aerosol 1747 ANTI-STATIC FREEZE SPRAY Contains additive that avoids static build-up, critical when working with ESD-sensitive components . For more information: 800-858-4043 — [email protected] MSDS / Specs: www.techspray.com R E N E W™ 1500-QT 1500-G 1500-72DSP TECHSPRAY RENEWTM branded cleaners are innovative solutions that combine the best of current “green – 30.5 kv 1635-20S 20 oz aerosol 1638 UNIVERSAL BULK CLEANER Powerful, non-flammable bulk cleaner that is ideal for manual cleaning of heavy greases, silicone, and other oils, R , RA and no-clean fluxes : Not available in Canada 1668-8S 8 oz aerosol 1668-18S 18 oz aerosol 5For more information: 800-858-4043 — [email protected] MSDS / Specs: www.techspray.com MAINTENANCE/SURFACE CLEANERS 1667-18S 1668-8S 1505-QT R E N E W™ Applications: Glass & Surface Cleaning ) in glass bottle 1654-5G 55 lbs in 5 gal (18.9L) metal drum 1654-54G 660 lbs in 54 gal (204L) metal drum 1655 VAPOR-DEGREASER FLUX REMOVER Precision-V Flux Remover cleans R , RA, RMA and SA type flux residues after high temperature reflow, wave and hand

adopt_News_46_e_20080227

condition ex works user New Arrivals Sanyo TCM 3000E Chipshooter 36.000 cp/ h , year 06/1999, tansport L-> R , rear rail fixed; Ref. 16185. 2 pcs. in stock! Sanyo TCM 3500Z Chipshooter 36.000 cp/ h , year 01/1999, transport L-> R , front rail fixed; Ref. 16187 Sanyo ´t influence the placement time too much. The throughput of a reflow oven can get doubled by using it dual lane. Pick & place machines / chip shooters, dual lane, L-> R front fixed • 7 pcs . Together with the refurbishment, we can also offer to retrofit the machines to single lane. Reflow ovens, dual lane, L-> R front fixed Rehm SMS N2 V6 3300 / 2×50-216, Nitrogen reflow oven with — 5 preheating zones, — 2 peak zones top and bottom — 2 cooling zones synchronic dual lane transport with center board support year 2001, Ref . in stock, all year 1997! Board handling equipment, dual lane, L-> R front fixed Universal 5362E, 22” inspection conveyor, transport width 2×70-180mm, year 1996, Ref . 6887 Asys BANDSTR, 2m, transport width 2×50-210mm, R ->L, front fixed, year 2000, Ref. 6961 Nutek NTM 410DT-10-2, 1m inspection conveyor, 2×2 segments, transport width 2×60-220mm, Ref. 11904, 2 pcs

IPADI & IPA 10-08 with photo.pmd

: None IN ALL CASES REFER TO THE MATERIAL SAFETY DATA SHEET (MSDS). INGREDIENTS: IPA/DI: Isopropyl Alcohol, DI Water & IPA 99.99%: Isopropyl Alcohol IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L ISOPROPYL ALCOHOLISOPROPYL . Saturated wipes, Foil Refill Packs, spray bottles, gallons, and drums are the available choices. Revised: 1.09 52IPA/DI & IPA 99% IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L IS O P R O P Y L A L C O H O L ADDITIONAL JNJ PRODUCTS OF INTEREST: • SmartWipe® Dry Wipes • AquaSonic

Electronics Overview 2010-CR

® division provides environ- mentally respon- s i b l e , e a r t h friendly chemi- cals and solvents — GlobalTech products are formulated for the rigor- ous cleaning require- ments of any workplace . YOUR COMPLETE SOURCE FOR CONSUMABLE SUPPLIES ESSENTIAL TO MAINTAINING THE HIGHEST QUALITY STANDARDS IN ASSEMBLY AND MANUFACTURING J N J IN D U S T R IE S JNJ INDUSTRIES 290 BEAVER STREET FRANKLIN MA & Holders and Understen- cil Rolls • Fast Delivery Worldwide Electronic & Industrial Supplies & Cleaning Products GlobalTech® Chemistries Fo il R ef ill P ac ks SmartWipes

Layout 1 SOUDAGE ET DESSOUDAGE REPARATION PAR CONVECTION EXTRACTION DE FUMEE DOSAGE DE FLUIDES www.metcal.com S O L U T I O N S P O U R L E B E N C H E L E C T R O N I Q U E EAP Cat v1 2013 French_Layout 1 20/03/2013 12 comprendre les besoins de nos clients et à leur fournir des produits professionnels à la fois innovants, fiables, d’un rapport prix compétitif et faciles d’utilisation. A V A N T A G E F O R M A T I O N — A V A N T A G E A P P L I C A T I O N — A V A N T A G E P R O D U C T I V I T E VECTION EXTRACTION DE FUMEE DOSAGE DE FLUIDES Visitez . P S — 9 0 0 M F R — 1 1 0 0 M F R — 2 2 0 0 Sortie Unique Double Sortie commutable PS-900 Série MFR-1100 Série MFR-1300 Soudage de Production Soudage / Dessoudage / Réparation Soudage / Dessoudage S Y S T È M E S D E R É P A R A Le pistolet de dessoudage est compatible avec tous les systèmes de série MFR* *Voir page 11 EAP Cat v1 2013 French_Layout 1 20/03/2013 12 systèmes. Manche ergonomique Panne-cartouche autorégulante (voir ci-dessous) Panne Elément chauffant Bobine Connecteur P S — 9 0 0 M F R — 1 1 0 0 M F R — 2 2 0 0 M F R — 1 3 0 0 Sortie Unique Double Sortie commutable Double Sortie Simultanée Vidéo de

Layout 1 SOUDAGE ET DESSOUDAGE REPARATION PAR CONVECTION EXTRACTION DE FUMEE DOSAGE DE FLUIDES www.metcal.com S O L U T I O N S P O U R L E B E N C H E L E C T R O N I Q U E EAP Cat v1 2013 French_Layout 1 20/03/2013 12 comprendre les besoins de nos clients et à leur fournir des produits professionnels à la fois innovants, fiables, d’un rapport prix compétitif et faciles d’utilisation. A V A N T A G E F O R M A T I O N — A V A N T A G E A P P L I C A T I O N — A V A N T A G E P R O D U C T I V I T E VECTION EXTRACTION DE FUMEE DOSAGE DE FLUIDES Visitez . P S — 9 0 0 M F R — 1 1 0 0 M F R — 2 2 0 0 Sortie Unique Double Sortie commutable PS-900 Série MFR-1100 Série MFR-1300 Soudage de Production Soudage / Dessoudage / Réparation Soudage / Dessoudage S Y S T È M E S D E R É P A R A Le pistolet de dessoudage est compatible avec tous les systèmes de série MFR* *Voir page 11 EAP Cat v1 2013 French_Layout 1 20/03/2013 12 systèmes. Manche ergonomique Panne-cartouche autorégulante (voir ci-dessous) Panne Elément chauffant Bobine Connecteur P S — 9 0 0 M F R — 1 1 0 0 M F R — 2 2 0 0 M F R — 1 3 0 0 Sortie Unique Double Sortie commutable Double Sortie Simultanée Vidéo de

Maximum paste size Minimum paste size Maximum paste height Height resolution Height accuracy Height repeatability Volume repeatability Gage R & R Cycle time Height, Area, Volume, Offset, Bridging, Shape 2D, Shape 3D, Coplanarity Insufficient / Excessive / Missing paste, Bridge, Shape 2D, Shape 3D, user defined defects 20 mm x 20 mm 150 µm x 150 µm 400 µm ) Offline SPC SIGMA Import (Gerber & CAD data) Histograms, X- R charts, Signature, Cp/Cpk, Gage R & R SIGMA Analysis (Web-based software) Options External barcode reader (1D/2D ) Internal barcode reader (1D/2D) Closed loop to printers Others Cognex DM 150 (requires 1 000 mm conveyor) Yes With all major printers Consult us Interface Power requirements Dimensions (W x D x H

Maximum paste size Minimum paste size Maximum paste height Height resolution Height accuracy Height repeatability Volume repeatability Gage R & R Cycle time Height, Area, Volume, Offset, Bridging, Shape 2D, Shape 3D, Coplanarity Insufficient / Excessive / Missing paste, Bridge, Shape 2D, Shape 3D, user defined defects 20 mm x 20 mm 150 µm x 150 µm 400 µm (Statistical Process Control) Offline SPC SIGMA Import (Gerber & CAD data) Histograms, X- R charts, Signature, Cp/Cpk, Gage R & R SIGMA Analysis (Web-based software) Options External barcode reader (1D/2D) Internal barcode reader (1D/2D) Closed loop to printers Others Cognex DM 50 (requires 1 000 mm conveyor) Yes With all major printers Consult us Facilities Interface Power requirements Dimensions (W x D x H

Q-Broc12-15-08.pdf

H I G H R E L I A B I L I T Y Q U A L I T Y Look into our manufacturing facility and you’ll see an assortment of high-tech equipment . P A R T N E R S H I P S In-Tech, a Hong Kong based company with a 500,000 square-foot facility in China, allows us to provide our customers with a complete offshore Electronics Manufacturing Services solution Q-Broc12-15-08.pdf E L E C T R O N I C S M A N U F A C T U R I N G S E R V I C E S Electronics Ltd In-Tech A E R O S P A C E M E D I C A L M I L I T A R Y C O M M E R C I A L At Qualitel ’ needs and on developing partnerships that make each party stronger. In the end, we believe that we succeed only to the extent that our customers succeed. H I G H M I X . And they work to ensure that success every day. A E R O S P A C E At Qualitel, we continually strive for new ways to ensure that our customers are completely satisfied with the quality of our products and services

Circuits Assembly — January 2009 — MB Manufacturing

Behavior,”Amsterdam, 2004. IPC-7912, Calculation of DPMO and Manufacturing Indices for Printed Board Assemblies, July 2000. R . Mendez, C. Hamilton, “Design for Manufacturability in the Lead Free Wave Solder Process,” IPC Apex, April 2008. J. Nguyen, et al , “Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability,” Apex, April 2008. H . Holder, et al, “Reliability of Partially Filled SAC 305 Through-Hole Joints,” IPC Apex, February 2006. C. Hamilton and M. Kelly, “A Study of Alternative

Circuits Assembly — January 2009 — MB Manufacturing

Behavior,”Amsterdam, 2004. IPC-7912, Calculation of DPMO and Manufacturing Indices for Printed Board Assemblies, July 2000. R . Mendez, C. Hamilton, “Design for Manufacturability in the Lead Free Wave Solder Process,” IPC Apex, April 2008. J. Nguyen, et al , “Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability,” Apex, April 2008. H . Holder, et al, “Reliability of Partially Filled SAC 305 Through-Hole Joints,” IPC Apex, February 2006. C. Hamilton and M. Kelly, “A Study of Alternative

Density (g/ccm) at 20º C (68º F)

. c o m N o r th A s ia S h a n g h a i/ S h e n z h e n – C h in a in fo c h in a @ z e s tr o n . c o m S o u th A s ia K u li m 10.13.2015 T E C H N I C A L I N F O R M A T I O N 1 Water-based, pH neutral defluxing agent for spray-in-air cleaning processes VIGON ® N 600 is an MPC ® Technology based, innovative defluxing product with a revolutionary pH neutral formulation . c o m N o r th A s ia S h a n g h a i/ S h e n z h e n – C h in a in fo c h in a @ z e s tr o n . c o m S o u th A s ia K u li m 10.13.2015 T E C H N I C A L I N F O R M A T I O N 1 Technical Data: VIGON® N 600 at 15% concentration. Density (g/ccm) at 20°C/68°F 1.00 Surface tension (mN/m) at 25°C/77°F 27.1 Boiling point °C/°F 98 — 229 / 208 — 444 Flash point Density (g/ccm) at 20º C (68º F) E u r o p e In g o ls ta d t– G e r m a n y in fo @ z e s tr o n . c o m A m e r ic a M a n a s s a s , V A – U S A in fo u s a @ z e s tr o n

. W i t h p r e s e n t h i g h — e n d assemblies, corrosion can also induce electrochemical dendrites resulting in leakage currents, which increasingly affect the reliability and life of the boards

Current Inventory

$2,750 Feeders Equipment Details Inventory # Qty Tray Feeders PTF Platform Tray Feeder… H Block BE5315 1 PTF H Block (Must stay in China) BE5392 1 PTF H Block BE5294A 1 PTF Platform Tray Feeder & Follow PTF Conveyor Rear Rail Fixed 24″ Board width 110V Dedicated, CE, 24″ Brd Width Max, Rear rail fixed, L- R , 3mm edge BE5124 1 40″ Edge Conveyor HEAVY DUTY type BE5191 1 40″ Edge Conveyor HEAVY (Columbia Tech Type 6241F/6380B/G/ H ) BE5248 1 IM Magazine Unloader (Columbia Tech Type 6241F/6380B/G/ H ) BE5249 1 36″ 1 Belt Edge Conveyor with Pusher BE5256 1 SMT Magazine Loader BE5251 1 SMT Magazine Unloader BE5252 1 SMT Magazine Loader BE5263 1 SMT Magazine Unloader BE5264 1 Vacuum type Raw Board Elevator/Loader L to R — Sold ‘as-is’ BE4955 1 Non-Universal Instruments Equipment Equipment Details Inventory # Qty Siemens S23 Chip Placement Machine 1 Siemens F5 Multifunction with Tray Tower 1 MPM Accuflex Screen Printer 1 ShareThis MyUniversal Login What is MyUniversal? English 简体中文

MC-5792B_Generation_88HT-中文版-修改后.ai

备,就可将插件机的性能和可靠性进一步提升,所需的投资远远低于购买全新设备。 •  R a d i a l  8 8 H T插件机采用伺服马达驱动来提高  各运动轴的速度、精度和可靠性 • 持续的高性能表现 • 提高设备利用率,降低维护成本 伺服驱动 • 元件检验器可在设备上检验待插元件的参数  和极性 • 降低插入有缺陷、错序、参数或极性错误元件  的风险 元件检验器 • 排序模组将元件从卷盘或物料盒送至设备 • 配有最新的防阻塞、可交替送料器及双步距送  料器,加 快速度和提高产能 元件送料器 • 可在卷带上自动插入非传统的异型元件,包括   L E D s、端子、连接器、保险丝盒、电阻及孔眼  金属圈 • 能提高产品质量及每平方米的产量,降低成本 异型元件装配功能 •  R a d i a l  8 8 H T插件机是目前最经济、最环保的  径向插件机,耗电及耗气量都是最低的 • 较同类设备省电达67% 绿色设备 • 电路板自动上载/下载,在大批量生产时,减少  对操作员的依赖 • 电路板手动上载/下载,在高混合生产时,支持

) 2017.05.26 Saki will exhibit at «JISSO PROTEC 2017″(Booth No.5A-32) 2017.05.16 Saki will exhibit at «smt hybrid packaging» (Nuremberg, Germany) (May.16-18) Booth No; H . 2017.03.21 SAKI cotributed to IoT usecase map of Robot Revolution Initiative (4.21-4.23) 2015.04.09 «SMT Today» 采访 (You Tube) 2015.03.31 Saki will exhibit at SMT Hybrid Packaging 2015 (Germany) (May.5-7) 2015.03.26 Information of Integration of AXI R &D

SMT RESEARCH, INC

@smtresearch.com SMT Parts Store We have thousands of Fuji parts in stock. Enjoy savings of 30% to 70% on all surplus items. Visit us at Hwww.smtresearch.com H for the current listing of available parts or contact us with your requirements & 8 Tape Retainers FUJI P/N SMT RESEARCH P/N & DESCRIPTION NEW KJPC-0020 FC-0020 8 x 2 0.4mm tape retainer (0201 C & R ) 93.50 KJAC-1110 FC-1100 8 x 2 0.7mm tape retainer (slit less type . Please call us for details. CP-4 Cutter Blades FUJI P/N SMT RESEARCH P/N & DESCRIPTION REPAIR NEW MPK-0060 BC-3000 cutter blade (moving) 40.00 145.00 MPK-0080 BC-3010 cutter blade (stationary) 40.00 145.00 Please add an » R » to end of SMT P/N for repair “no good” sensor amplifier 250.80 EP4-321 EP2-3201 cartridge “no good” sensor fiber unit (replaces EP4-321) 60.00 R1009A FB-1009 fiducial camera bulb 60.00 AT-4029-X PB-4029X push button switch cover (replace X with G=green, R =red, Y=yellow) 10.00 A3SJ-580X PB-580X push button switch cover-new style (replace X with G=green, R =red, Y=yellow) 15.50 AT-616-X PB-616X push button switch LED (replace X with G=green, R =red, Y=yellow) 12.50 LB-15-RKS-X PB-1506X push button switch assembly-6 pin connector, cover

) High Resolution Color CCD Camera 24mm x 26mm LED-based white light .33 Sec./FOV 1µm (0.00004”) .010″, this film meets stringent requirements for a wide range of electrical and electronic applications. UL File Number: E61257( R ). Potential applications include ) 130 125 130 130 125 130 130 125 130 UL LISTING SUMMARY File #E61257( R ) mils mm 10–14 .25–.35 15–29 .38–.74 ž 30 ž .76 LEXAN FR–700 (FR7+) bk bk bk Thickness Relative Thermal Index V

GE LEXAN FR-60, FR-63, FR-65, FR-66 Film

(PLCs) H D H H V 4 C W A T 9 T I I R 5 I 1 0 — — 3 0 0 — — 3 0 0 — — 3 Material Color UL–94 Flame Rating* *This rating is not intended to reflect hazards presented by this or any other material under actual fire conditions. With Elong ** listing, this film meets stringent requirements in a wide range of electrical/electronic, automotive and construction applications. UL File Number: E61257( R ). Potential applications include * g GE Plastics Structured Products General Electric Company One Plastics Avenue, Pittsfield, MA 01201-3697 UL LISTING SUMMARY File #E61257( R ) mils mm 10–14 .23–.35 15–29 .38–.74 •30 •.76 LEXAN FR–60 (FR6

Creative Electron » Bill Cardoso

. Unlike large corporations, we can’t afford losing money on large R &D projects that go nowhere. But revolutions don’t start in vacuum. To focus our objectives as the TruView Prime R . This benchtop unit does reel to reel automated inspection, and is considered the reference in x-ray inspection for counterfeit detection. 9. The All New TruView Cube It’s been almost a year now that we launched the new TruView Cube heading to Japan to showcase our TruView Parts Counter at NEPCON Japan in Tokyo from January 17-19. If you haven’t been to NEPCON Japan yet, well, you must. NEPCON is Asia’s largest exhibition for electronics design, R &D and manufacturing technology Launched in 1972, NEPCON Japan has grown together with the Japanese & Asian electronics industry. Consisting of 7 shows specialised in essential areas for electronics manufacturing and R &D, the show has increased its value as an exhibition representing ″ TruView™ Fusion R : Reel-to-reel inspection TruView™ Fusion X: Large format inspection to boards up to 48″x20″ Don’t hesitate to contact us for more information! Oct 19 2016 Most Innovative New Product Awards Finalist by Bill Cardoso in Creative Electron

Can radiation damage electronic components.pptx

. With time, or high flux, the e- h pairs created in the oxide either recombine or move towards the SiO2-Si interface, altering the characteristics of the semiconductor. Single event upset ) Most components show failures starting at least at a few thousands of R , or millions of mR Commercial airplanes are exposed to

30,000mR of background radiation that has more particles than

Testimonials | Baja Bid LLC — Page 4

! His customer service and attention to detail are excellent. We have used his auction in the past with great success as well. I highly recommend… Read more Frank H . [May 2014] I participated in recent auction and purchased some items . Representation of articles was accurate, availability of Jocelyn Long was never an issue,… Read more Jose R . [January 2014] We recently took advantage of the equipment sale at OSI and I wanted to take this opportunity to thank you and the others at BAJA Bid for ensuring the process was organized and managed well

Testimonials | Baja Bid LLC — Page 5

. Their access to the buyer and seller community provides an excellent experience on both sides of the transaction. We will continue to take advantage of their great service and I highly recommend the team at Baja… Read more Peter H . [November 2013 . I would be happy to recommend you and your… Read more Adan R . [October 2013] I just wanted to take this opportunity to thank you for the complete and upmost professionalism I experienced with your company recently

P-LED r0 5.9.18

% 50/60Hz Power Consumption 3kW Air Supply 4

6Kgf/cm² Dimension (excluding signal tower) 2,570 mm (L) x 1,210 mm (W) x 1,509 mm ( H ) Machine Weight 1,800kg OPERATOR INTERFACE Hardware LCD Monitor, Mouse ) &Motorized side clamp Support Method Std. Magnetic support pins, bars, blocks. Conveyor Direction L to R , R to L, R to R , L to (software control) Conveyor Height 900

(excluding signal tower) 1,590 mm (L) x 1,608mm (W) x 1,530 mm ( H ) Machine Weight 1,400 kg OPTIONS Stencil Apertures Inspection System SPI Closed-Loop Temperature, Humidity Monitoring 3.5 mm PCB Bottom Clearance 23 mm PCB Warpage Max. 1% diagonally Clamping Method Retractable top clamp, motor controlled side clamp Support Method Magnetic support pins, bars, blocks, vacuum suction Conveyor Direction L to R , R to L, R to R , L to L (software control

CheckSum In-Circuit Test Strategy

$0.25 I C T C o s t p e r b o a r d ( $ ) Support Fixture+Program System $0.20 $0.08 2001 2004 CS Overview 3.4 040728 4 How? By recognizing that the ‘testing truths . — 100 200 300 400 500 600 700 800 900 D e f e c t s p e r m i l l i o n p a r t s o r o p e r a t i o n s Solder-Related Defect Rate Process Defect Rate Parts Defect Rate 1999 2004 CS Overview & Resources T o t a l T e s t C o s t A CS Overview 3.4 040728 10 Why? More tester resources means increased system complexity and higher fixed overhead cost Tester Resources T o t a l C o s t o f U s i n g T e s t e r Trad ition al IC T Co st p rofil e Trad ition al IC T Co st p rofil e Appl icatio n Co st (fixtu res & prog rams ) Complexity and cost increase hand-in-hand… Teste r Ope rating & Sup port C ost Fixed Costs (Depreciation, etc :” Implement on Low Cost ICT whenever feasible. Only boards requiring extensive resources are tested on high cost ICT. E F G H D CS Overview

Microsoft Word — front.doc

E A S Y B R A ID www.easybraidco.com www.easybraidco.com E A S Y B R A ID Summary Established in 1989 EasyBraid Co. has achieved widespread recognition as a provider and manufacturer of supplies and equipment used in the PCB assembly industry www.easybraidco.com E A S Y B R A ID EB-9000PS Power Supply SHH-1 Soldering Handpiece Holder SHP-1 Soldering Handpiece RMP-1 Tip Removal Pad SG-1-GR Handpiece Grip Green SG-1-GY Handpiece Grip Gray BC-1 Brass Curls ): 40 Watts Output Frequency: 13.56 MHz Size (W x H x D): 212mm x 118mm x 132mm Weight: 3.47 KG LCD display: 60mm x 16mm Input Line Frequency . Dual switchable soldering ports. No calibration or operator training required. No additional coil assembly costs. PACKING LIST E A S Y B R A ID FUMECUBE Voltage . Please contact your local distributor for advice. * Use in combination 200316 FUME EXTRACTION SYSTEMS PUREX E A S Y B R A IDCERTIFICATION MARKS B C EB-9000S EBM Series Tip Cartridges CHISEL CHISEL BENT CONICAL BENT CONICAL BEVEL KNIFE BLADEHOOF A C Part

E A S Y B R A ID www.easybraidco.com THERMALTRONICS PRODUCT CATALOG www.easybraidco.com E A S Y B R A ID EB-9000PS Power Supply SHH-1 Soldering Handpiece Holder SHP-1 Soldering Handpiece RMP-1 Tip Removal Pad SG-1-GR Handpiece Grip Green SG-1-GY Handpiece Grip Gray BC-1 Brass Curls )UHTXHQF\ 0+] 6L] H :[+[‘ 212mm x 118mm x 132mm Weight: .* /&’GLVSOD\ 60mm x 16mm ,QSXW/LQH)UHTXHQF\ +] EB-9000S Soldering & Rework Station EB-9000S The EB-9000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, WKHUHE\PHHWLQJ WKH H \FRVWV PACKING LIST E A S Y B R A ID B C EB-9000S EBM Series Tip Cartridges CHISEL CHISEL BENT CONICAL BENT CONICAL BEVEL KNIFE BLADEHOOF A C Part Number MM IN. MM = Standard Applications 8 = High Performance www.easybraidco.com E A S Y B R A ID POWER PLUS EBM Series Power Plus Power Plus — High Performance, Longer Tip Life A C CHISEL CONICAL A C Part Number MM IN. MM \GXW\MREV ZLWKRXWLQFUHDVLQJWKHWLSWHPSHUDWXUH E A S Y B R A ID MICRO FINE EBM Series Micro Fine A C CHISEL CONICAL A C Part Number MM IN. MM IN. EBM7CH006

Best Practices Award Template

e rs h ip i n C u s to m e r V a lu e L e a d e rs h ip i n M a rk e t P e n e tr a ti o n W e ig h te d R a ti n g Relative Weight (%) 20% 20% 20% 20% 20% 100% MIRTEC Co. Ltd. 9 9.5 9.5 9.5 9 9.3 Competitor 1 8 7.5 8 7 9 : Decision Support Matrix for Company of the Year Award Measurement of 1–10 (1 = lowest; 10 = highest) Award Criteria G ro w th S tr a te g y E x c e lle n c e G ro w th I m p le m e n ta ti o n E x c e lle n c e D e g re e o f In n o v a ti o n w it h P ro d u c ts a n d T e c h n o lo g ie s L e a d

” Global Customer Support Integrated INTELLI-BEAM® Laser Inspection System Four Point Height Measurement for Co-Planarity Testing of BGA and CSP Devices Enhanced 3D Solder Paste Measurement Capability w w w . m i r t e c . c o m Intel ® Core™2 Duo PC, 24 . Precision Closed Loop Micro Stepper Positioning System 6 um (.000236 in.) ±15 um (± 0.000591 in.) 0.37sec / frame — 8.946 mm 2 / sec (11.046 in 2 / sec) 110-220 VAC ± 10%; 50/60 Hertz; 5 Amps 975mm W x 1,200mm D x 655mm H (38.3” W x 47.2” D x 25.8” H ) 1,185mm W x 1,455mm D x 690mm H (46.6” W x 57.2” D x 27.2” H ) 110kg (242lbs) 160kg (352 lbs) T E C H N O L O G I C A L L Y A D V A N C E D

Specifications

) z PCB Handling SMEMA interface z Conveyor direction L/ R , R /L, batch mode R / R , L/L z Automatical width adjustment < Conveyor extensions ) Piezo Jet valve Pneumatic Jet valve Time/pressure valve Archimedean screw valve 150’000 dots/ h 80’000 dots/ h 28’000 dots/ h 24’000 dots/ h Dispensing mode dot, line, 3D, curve, interpolated curves on multiple layers Programmable z-stroke 80 mm (3.35″) Process height ± 18 mm (0.71”) from zero height 3

Specifications

)  LP Handling SMEMA Schnittstelle  Bandführung L/ R , R /L, Batch Modus R / R , L/L  Automatische Breiteneinstellung  Transportbanderweiterung  LP )  Dispensing Kalibrierungsset  SPIDER Prozess Dispensgeschwindigkeit bis2) Piezo Jet Ventil Pneumatisches Jet Ventil Zeit/Druck Ventil Archimedisches Schraubenventil 150’000 Pkt./ h 80’000 Pkt./ h 28’000 Pkt./ h 24’000 Pkt ./ h Dispensiermodus Punkte, Linien, 3D, Kurven, interpolierte Kurven auf mehreren Ebenen Programmierbarer z-Höhe 80 mm (3.35″) Prozesshöhe ± 18 mm (0.71”) von Null Höhe 3) Genauigkeit Auflösung lineare Encoder

Product Stewardship

” depending on the level of risk. The previous R and S phrases have been replaced by hazard phrases ( H phrases) and precautionary phrases (P phrases

Factbook 2014 V1.pdf

. These pillars include: 1. increasing profitability, 2. intensifying innovation and Research & Development ( R &D), 3. selectively growing and strengthening our global presence, with a focus on emerging markets, and 4 the company’s regional presence are still being pursued. the Four strateGIc PIllars 1. Increase profitability 2. Foster innovation and R &D 3. Intensify growth 4. Reposition portfolio FInancIal tarGets to compensate for inflation-related increases in company wide costs. The self-help measure contributes CHF 60-100m in savings each year. 12 strateGIc PIllar 2: Foster InnovatIon anD r &D Target: Improve innovation success rate and generate additional sales growth of 1–2 percentage points by launching innovative products. R &D is the basis of profitable growth. Innovation encompasses the entire value chain, from the initial idea to the successful market launch of new products. Clariant’s four technology platforms linked to sustainability, offer attractive market and innovative potential and pave the way for R &D to ad- dress the challenges of tomorrow. The technology platform, Chemistry & Materials, is comprised of four Competence Centers – Surfactants, Specialty

FUJI NXT M3S Modules

: Strip, feed tube, feed pan (M3 x 8:8 mm strip of up to 160) Machine size: 2M Base: 740 (L) x 1934 (W) 4M base: 1390 (L) x 1934 (W) H : 1474 mm (M3S) 1476 mm (M6S) r type=»_moz»> FUJI NXT M3S Modules Equipment : Strip, feed tube, feed pan (M3 x 8:8 mm strip of up to 160) Machine size: 2M Base: 740 (L) x 1934 (W) 4M base: 1390 (L) x 1934 (W) H : 1474 mm (M3S) 1476 mm (M6S) r type=»_moz»> 2016 © Shenzhen TAIJEE Electronic Equipment Ltd

SMT 1.7 TC Reflow Oven — SMT Xtra

1.7 TC Reflow Oven Vintage – 2001 Flow – L> R 3 Zone Edge Conveyor Mesh belt Touch screen colour monitor Patented SMT slot nozzles Lead-free ready, at low peak temperatures Monitoring and indication of conveyor speed & zone temperatures Alarm high/low temperature Small footprint Low energy consumption, only 3 kW h Easy maintenance Categories Machine Sales SMT Feeders ASM (Siemens

(см. рис. 1). основные цифровые узлы платы (выборочно): – плиС eP3C16F484C8n; – процессор LPC2468FeT208 (ядро ArM7); – e t h e r n e t — п р и е м о п е р е д а т ч и к KsZ8041; – usB-контроллер isP1763; – озУ sdrAM ddr2 MT47H64M8

Pulse-Spray Flux System Slide-In Configuration

. In the underfill process, there is Design Considerations for Package on Package Underfill t h e s h o r t s t o r y ◼ Package-on-package (PoP) is a recognized technology that is becoming more commonplace in mobile electronics with the increased demand for features like cameras, Bluetooth, FM radio, WLAN and mobile TVs . Illustration Courtesy of Amkor Technology. C o V e r S T o r y By Brad Perkins, Asymtek 0.33mm gap between devices Underfill Underfill 23ga needle 0.33mm ID . Fluid reservoirUnderfill flow fronts C o V e r S T o r y can be seen. With jetting, the access holes can be less than 0.5mm in diam- eter without compromising through- put or accuracy

V-MOLE Product Brochure (2014-03)

: 175 ma via USB Interface Operating Range: 4.2V to 3.2V POWER EN 301 489-01 V1.8.1:2008 EN 300 328 V1.7.1:2006 EN 301 489-17 V2.1.1:2009 EN 60950 R &TTE 1999/5/EC Low-voltage Directive 2006/95/EC RoHS 2002/95/EC WEEE 2002/96/EC COMPLIANCE • Soft Carrying Case SYSTEM INCLUDES (ECD P/N: E48-0509-00): Dimensions (L x W x H ): • Profiler: 145mm (5.7”) x 64mm (2.5”) x 7.62mm (.3”) • Barrier: 229mm (9”) x 84mm (3.3”) x 25mm (.98”) • Yellow Jacket: 257mm (10.2”) x 97mm (3.8”) x 31mm (1.2”) Weight

SuperM.O.L.E. Gold® — Users Help Guide [5.0.1]

and UCL SPC Sheet Boxes Guide Worksheet Guide Worksheet Menus & Toolbar SPC Worksheet SPC Worksheet Menus & Toolbar X-Bar Chart R Chart Statistics Box Renaming SPC Worksheets Menu and Tool Commands File Menu New Workbook Paste Specification Database Open Workbook Close Workbook Import Save Workbook Save (Temperature Reference Lines) Oven Configure Zone Configuration Temperatures Conveyor speed Oven Models Zone Matrix Calculate h -Factor Paste Selection Adding a Paste Specification Profile Defaults Sub-Menu M.O.L.E

. BEST Adhesive Strength Study of Various Repair Adhesive Systems and Techniques September 2005 4 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 M e a n P ul l S t r e ngt h ( l b- i n ” phenolic butral film 1” wide sample strips (with the last ½” not adhered to accommodate the peel strength testing machine grippers) were adhered to the substrate using the following process: H . The copper sample strips were cut into 3” x 1” sample sizes. Q. The curing oven was pre-heated to 150ºC R . The samples were placed into position on the FR4 surface

Microsoft PowerPoint — Mfg Rel Challenges with QFN — ASQ RS [Read-Only]

) C h a r a c t e r i s t i c L i f e ( C y c l e s t o F a i l u r e ) tf = Tn n = 2 (SnPb) n = 2.3 (SnNiCu) n = 2.7 (SnAgCu) 19 19 Industry Response to SJ Wearout

Name in hidden column R on the smelter list 4. Addition of ISO Country Codes and State/Province Codes in hidden columns S and T on the smelter list 5. Renaming of «Smelter Reference List» to «Smelter Look-up» 6. Updates to translations for all modified only” — a reviewof supplier submitted records and documentation conducted by independent third parties and, or your company personnel. “Internal audit” — on-site audits of your suppliers conducted by your company personnel. This question is mandatory. H

Name in hidden column R on the smelter list 4. Addition of ISO Country Codes and State/Province Codes in hidden columns S and T on the smelter list 5. Renaming of «Smelter Reference List» to «Smelter Look-up» 6. Updates to translations for all modified only” — a reviewof supplier submitted records and documentation conducted by independent third parties and, or your company personnel. “Internal audit” — on-site audits of your suppliers conducted by your company personnel. This question is mandatory. H

PASSIVE COMPONENTS — PCB Assembly,PCB Manufacturing,PCB design — OURPCB

. We know the very popular formula of ohms law V=I x R where R = Resistance. The resistor is available in SMD and through-hole packages = Absolute permeability of core material A = Cross sectional Area of coil l = Average length of coil The unit of inductance is Henry ( H ). The most commonly used units are mili Henry, micro Henry and nano Henry

PCB trace impedance control — PCB Assembly,PCB Manufacturing,PCB design — OURPCB

: Trace thickness, T Trace width, W Height of the dielectric substrate, H Dielectric constant of the substrate material, ε r When the signal encounters a variation in impedance, due to a change in substrate material or trace geometry, only part of the signal will be transmitted, while the other part will be reflected

1511_Viscom_Brochure_S3088_SPI_zh.indd

Closed Loop SPI/Print SPI/P&P SPI-MXI-UplinkSPI-AOI-/AXI-Uplink 技术数据 # V is co m _S Y S _S 30 88 S P I_ C H N 15 11 00 05 . N ov em b er 2 01 5 德国(总部 远程诊断 Viscom SRC (选项) Viscom SRC (选项) 编程站 Viscom PST34 (选项) Viscom PST34 (选项) 系统计算机 操作系统 Windows® Windows® 处理器 Intel® Core™ i7 Intel® Core™ i7 性能 测量规格 重复准确性 高度评估